Datasheet Texas Instruments AM3892 — 数据表
制造商 | Texas Instruments |
系列 | AM3892 |
Sitara处理器
数据表
价格
状态
AM3892CCYG120 | AM3892CCYG135 | |
---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No |
打包
AM3892CCYG120 | AM3892CCYG135 | |
---|---|---|
N | 1 | 2 |
Pin | 1031 | 1031 |
Package Type | CYG | CYG |
Industry STD Term | FCBGA | FCBGA |
JEDEC Code | S-PBGA-N | S-PBGA-N |
Package QTY | 44 | 44 |
Carrier | JEDEC TRAY (5+1) | |
Device Marking | 120 | 135 |
Width (mm) | 25 | 25 |
Length (mm) | 25 | 25 |
Thickness (mm) | 2.81 | 2.81 |
Pitch (mm) | .65 | .65 |
Max Height (mm) | 3.31 | 3.31 |
Mechanical Data | 下载 | 下载 |
参数化
Parameters / Models | AM3892CCYG120 | AM3892CCYG135 |
---|---|---|
ARM CPU | 1 ARM Cortex-A8 | 1 ARM Cortex-A8 |
ARM MHz, Max. | 1350 | 1350 |
Applications | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
DRAM | DDR2,DDR3 | DDR2,DDR3 |
Display Options | HDVPSS | HDVPSS |
EMAC | 10/100/1000 | 10/100/1000 |
Graphics Acceleration | N/A | N/A |
I2C | 2 | 2 |
On-Chip L2 Cache | 256 KB (ARM Cortex-A8) | 256 KB (ARM Cortex-A8) |
Operating Systems | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE |
Operating Temperature Range, C | 0 to 95 | 0 to 95 |
Other On-Chip Memory | 576 KB | 576 KB |
Rating | Catalog | Catalog |
SPI | 1 | 1 |
UART, SCI | 3 | 3 |
USB | 2 | 2 |
Video Port, Configurable | 1 HDMI TX,2 Input,2 Output,3 HD DACS,4 SD DACs | 1 HDMI TX,2 Input,2 Output,3 HD DACS,4 SD DACs |
生态计划
AM3892CCYG120 | AM3892CCYG135 | |
---|---|---|
RoHS | Compliant | Compliant |
应用须知
- DM816x, C6A816x, and AM389x OverviewPDF, 29 Kb, 档案已发布: Jul 7, 2011
This article provides an overview of the DM816x, C6A816x, and AM389x product families and has been contributed to the TI Embedded Processors Wiki. To see the most recently updated version or to contribute, visit this topic at:http://processors.wiki.ti.com/index.php/DM816x_C6A816x_AM389x_OverviewAll t - TMS320DM816x/C6A816x/AM389x DDR3 Initialization With Software LevelingPDF, 21 Kb, 档案已发布: Mar 1, 2011
This article has been contributed to the TI Embedded Processors Wiki. The article describes how to initialize the DDR3 on the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x Integraв„ў DSP+ ARMВ® processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) PG1.1 samples using the software leveling process.To see the most recently updated version or to cont - PCIe to USB on the TMS320DM816x/TMS320C6A816x/AM389x Evaluation BoardPDF, 22 Kb, 档案已发布: Mar 1, 2011
This article has been contributed to the TI Embedded Processors Wiki. The article describes using the PCI ExpressВ® ( PCIeВ®) to the USB host controller card on the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x Integraв„ў DSP+ ARMВ® processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) family of devices running Linux kernel from a PSP package. This - TMS320DM816x/TMS320C6A816x/AM389x Power Estimation SpreadsheetPDF, 30 Kb, 档案已发布: May 18, 2011
This article has been contributed to the TI Embedded Processors Wiki. It describes how to model power consumption for a user's application and to present some measured power scenarios for the TMS320DM816x DaVinciв„ў digital media processors, TMS320C6A816x C6-Integraв„ў DSP+ARM processors, and AM389x Sitaraв„ў ARMВ® microprocessors (MPUs) PG1.0 samples using a provided power estimati - DM816xx Easy CYG Package PCB Escape Routing (Rev. A)PDF, 675 Kb, 修订版: A, 档案已发布: Mar 19, 2015
The DM816x CYG package is designed with a new technology called a Via Channelв„ў array. This technology allows for easy routing of the device in two signal and two power layers using large throughhole via diameters and standard trace widths; it is cost and time effective. Where more than four printed circuit board (PCB) layers are used, the routing is much more open and flexible than a regular - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
模型线
系列: AM3892 (2)
制造商分类
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A8> AM3x