Datasheet Texas Instruments XAM5718AABCXEA — 数据表
| 制造商 | Texas Instruments |
| 系列 | AM5718 |
| 零件号 | XAM5718AABCXEA |
Sitara处理器760-FCBGA -40至105
数据表
AM571x Sitara Processors Silicon Revision 2.0 datasheet
PDF, 4.2 Mb, 修订版: F, 档案已发布: Sep 11, 2017
从文件中提取
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 760 |
| Package Type | ABC |
| Industry STD Term | FCBGA |
| JEDEC Code | S-PBGA-N |
| Carrier | JEDEC TRAY (5+1) |
| Device Marking | XAM5718AABCXEA |
| Width (mm) | 23 |
| Length (mm) | 23 |
| Thickness (mm) | 2.39 |
| Pitch (mm) | .8 |
| Max Height (mm) | 2.96 |
| Mechanical Data | 下载 |
参数化
| ARM CPU | 1 ARM Cortex-A15 |
| ARM MHz (Max.) | 1500 |
| ARM MIPS(Max.) | 5250 |
| Application | Communications Equipment Enterprise Systems Industrial Personal Electronics |
| Approx. Price (US$) | 30.05 | 1ku |
| CAN(#) | 2 |
| CSI-2 | 2 |
| Co-Processor(s) | 2 ARM Cortex-M4 4 PRU-ICSS |
| DMA(Ch) | 64-Ch EDMA |
| DRAM | DDR3(L) |
| DSP | 1 C66x |
| DSP MHz (Max.) | 750 |
| Display Options | 1 HDMI out 3 LCD out |
| EMAC | 10/100/1000 2-Port 1Gb Switch |
| General Purpose Memory | 1 16-bit (GPMC NAND flash NOR Flash SRAM) |
| Graphics Acceleration | 1 3D 1 2D |
| HDMI | 1 |
| I2C | 5 |
| IO Supply(V) | 1.8 3.3 |
| Industrial Protocols | 1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III |
| LCD | 3 |
| MMC/SD | 4 |
| McASP | 8 |
| On-Chip L1 Cache | 32 KB (ARM Cortex-A15) 32 KB (C66x) |
| On-Chip L2 Cache | 1 MB w/ECC (ARM Cortex-A15) 288 KB (C66x) |
| Operating Systems | Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE |
| Operating Temperature Range(C) | -40 to 105 0 to 90 |
| Other Hardware Acceleration | Crypto Accelerator |
| Other On-Chip Memory | 512 KB w/ECC |
| PCI/PCIe | 2 PCIe |
| PWM(Ch) | 3 |
| Package Group | FCBGA |
| QSPI | 1 |
| RTC | 1 |
| Rating | Catalog |
| SATA | 1 |
| SPI | 4 |
| Security Enabler | Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment |
| Serial I/O | CAN I2C SPI UART USB |
| UART(SCI) | 10 |
| USB | 2 |
| USB 2.0 | 1 |
| USB 3.0 | 1 |
| Video Port (Configurable) | 6+ |
| Video Resolution/Frame Rate | 1080p60 |
| eCAP | 3 |
| eQEP | 3 |
生态计划
| RoHS | Compliant |
| Pb Free | Yes |
设计套件和评估模块
- Development Kits: TMDXIDK5718
AM571x Industrial Development Kit (IDK)
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: TMDSEVM572X
AM572x Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: TMDSCM572X
TMDSEVM572x Camera Module
Lifecycle Status: Active (Recommended for new designs) - Development Kits: TMDXIDK57X-LCD
AM57x IDK LCD Kit
Lifecycle Status: Active (Recommended for new designs)
应用须知
- DSPLIB for Processor SDK RTOSPDF, 461 Kb, 档案已发布: Nov 4, 2016
- AM572x GP EVM Power SimulationsPDF, 22.4 Mb, 档案已发布: Oct 8, 2015
The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target - IODELAY Application Note for AM57xx Devices (Rev. A)PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
- Code Composer Studio Device Support PackagePDF, 87 Kb, 档案已发布: Nov 19, 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS). - AM572x/AM571x Compatibility Guide (Rev. C)PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices. - AM57x Processor SDK Linux: Customization of Multicore Application to Run on a NePDF, 55 Kb, 档案已发布: Oct 6, 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they - EMIF Tools (Rev. A)PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes - Keystone EDMA FAQPDF, 1.3 Mb, 档案已发布: Sep 1, 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links. - AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages - TI DSP BenchmarkingPDF, 62 Kb, 档案已发布: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms. - Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
模型线
系列: AM5718 (7)
- AM5718AABCX AM5718AABCXA AM5718AABCXEA AM5718AABCXEQ1 AM5718AABCXQ1 XAM5718AABCXEA XAM5718ABCXE
制造商分类
- Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x