Datasheet Texas Instruments AM5718 — 数据表

制造商	Texas Instruments
系列	AM5718

数据表

价格

状态

打包

参数化

Parameters / Models	AM5718AABCX	AM5718AABCXA	AM5718AABCXEA	AM5718AABCXEQ1	AM5718AABCXQ1	XAM5718AABCXEA	XAM5718ABCXE
ARM CPU	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15	1 ARM Cortex-A15
ARM MHz, Max.	1500	1500	1500	1500	1500		1500
ARM MHz (Max.)						1500
ARM MIPS, Max.	5250	5250	5250	5250	5250		5250
ARM MIPS(Max.)						5250
Application	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment Enterprise Systems Industrial Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
Approx. Price (US$)						30.05 | 1ku
CAN	2	2	2	2	2		2
CAN(#)						2
CSI-2	2	2	2	2	2	2	2
Co-Processor, s	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS	2 ARM Cortex-M4,4 PRU-ICSS		2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)						2 ARM Cortex-M4 4 PRU-ICSS
DMA, Ch	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA	64-Ch EDMA		64-Ch EDMA
DMA(Ch)						64-Ch EDMA
DRAM	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3,DDR3L	DDR3(L)	DDR3,DDR3L
DSP	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x	1 C66x
DSP MHz, Max.	750	750	750	750	750		750
DSP MHz (Max.)						750
Display Options	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out,3 LCD out	1 HDMI out 3 LCD out	1 HDMI out,3 LCD out
EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC	10/100/1000 2-Port 1Gb Switch	10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC
General Purpose Memory	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)	1 16-bit (GPMC NAND flash NOR Flash SRAM)	1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)
Graphics Acceleration	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D,1 2D	1 3D 1 2D	1 3D,1 2D
HDMI	1	1	1	1	1	1	1
I2C	5	5	5	5	5	5	5
IO Supply, V	1.8,3.3	1.8,3.3	1.8,3.3	1.8,3.3	1.8,3.3		1.8,3.3
IO Supply(V)						1.8 3.3
Industrial Protocols	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III	1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
LCD	3	3	3	3	3	3	3
MMC/SD	4	4	4	4	4	4	4
McASP	8	8	8	8	8	8	8
On-Chip L1 Cache	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32KB (L1D and L1I ARM Cortex-A15)	32 KB (ARM Cortex-A15) 32 KB (C66x)	32KB (L1D and L1I ARM Cortex-A15)
On-Chip L2 Cache	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15) 288 KB (C66x)	1 MB w/ECC (ARM Cortex-A15),288 KB (C66x)
Operating Systems	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE	Android,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90	-40 to 105,-40 to 125,0 to 90		-40 to 105,-40 to 125,0 to 90
Operating Temperature Range(C)						-40 to 105 0 to 90
Other Hardware Acceleration	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator	Crypto Accelerator
Other On-Chip Memory	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC	512 KB w/ECC
PCI/PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe	2 PCIe
PWM, Ch	3	3	3	3	3		3
PWM(Ch)						3
Package Group	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA	FCBGA
QSPI	1	1	1	1	1	1	1
RTC	1	1	1	1	1	1	1
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SATA	1	1	1	1	1	1	1
SPI	4	4	4	4	4	4	4
Security Enabler						Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN I2C SPI UART USB	CAN,I2C,SPI,UART,USB
UART, SCI	10	10	10	10	10		10
UART(SCI)						10
USB	2	2	2	2	2	2	2
USB 2.0	1	1	1	1	1	1	1
USB 3.0	1	1	1	1	1	1	1
Video Port, Configurable	6+	6+	6+	6+	6+		6+
Video Port (Configurable)						6+
Video Resolution/Frame Rate	1080p60	1080p60	1080p60	1080p60	1080p60	1080p60	1080p60
eCAP	3	3	3	3	3	3	3
eQEP	3	3	3	3	3	3	3

生态计划

应用须知

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  The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
• 下载
  IODELAY Application Note for AM57xx Devices (Rev. A)
  PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
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  Code Composer Studio Device Support Package
  PDF, 87 Kb, 档案已发布: Nov 19, 2015
  This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
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  AM572x/AM571x Compatibility Guide (Rev. C)
  PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
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  AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
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  EMIF Tools (Rev. A)
  PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
  At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
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  Keystone EDMA FAQ
  PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
  This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
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  AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
  PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
  Application Note 1281 Bumped Die (Flip Chip) Packages
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  TI DSP Benchmarking
  PDF, 62 Kb, 档案已发布: Jan 13, 2016
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  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
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  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

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• Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x