Datasheet Texas Instruments XAM5728BABCXE — 数据表

制造商	Texas Instruments
系列	AM5728
零件号	XAM5728BABCXE

Sitara处理器760-FCBGA 0至90

数据表

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PDF, 4.6 Mb, 修订版: C, 档案已发布: Jun 6, 2017

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价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

打包

Pin	760	760
Package Type	ABC	ABC
Industry STD Term	FCBGA	FCBGA
JEDEC Code	S-PBGA-N	S-PBGA-N
Device Marking	SITARATM	XAM5728BABCXE
Width (mm)	23	23
Length (mm)	23	23
Thickness (mm)	2.39	2.39
Pitch (mm)	.8	.8
Max Height (mm)	2.96	2.96
Mechanical Data	下载	下载

参数化

ARM CPU	2 ARM Cortex-A15
ARM MHz (Max.)	1500
ARM MIPS(Max.)	10500
Application	Communications Equipment Enterprise Systems Industrial Personal Electronics
Approx. Price (US$)	40.47 \| 1ku
CAN(#)	2
Co-Processor(s)	2 ARM Cortex-M4 4 PRU-ICSS
DMA(Ch)	64-Ch EDMA
DRAM	DDR3(L)
DSP	2 C66x
DSP MHz (Max.)	750
Display Options	1 HDMI out 3 LCD out
EMAC	10/100/1000 2-Port 1Gb Switch
General Purpose Memory	1 16-bit (GPMC NAND flash NOR Flash SRAM)
Graphics Acceleration	2 3D 1 2D
HDMI	1
I2C	5
IO Supply(V)	1.8 3.3
Industrial Protocols	1588 EtherCAT EtherNet/IP POWERLINK PROFIBUS PROFINET RT/IRT SERCOS III
LCD	3
MMC/SD	4
McASP	8
On-Chip L1 Cache	32 KB (ARM Cortex-A15) 32 KB (C66x)
On-Chip L2 Cache	1 MB (ARM Cortex-A15) 288 KB (C66x)
Operating Systems	Android Integrity Linux Nucleus Neutrino TI-RTOS VxWorks Windows Embedded CE
Operating Temperature Range(C)	-40 to 105 0 to 90
Other Hardware Acceleration	Crypto Accelerator
Other On-Chip Memory	2.5 MB w/ECC
PCI/PCIe	2 PCIe Gen 2
PWM(Ch)	3
Package Group	FCBGA
QSPI	1
RTC	1
Rating	Catalog
SATA	1
SPI	4
Security Enabler	Cryptographic Acceleration Debug Security Device Identity External Memory Protection Initial Secure Programming Physical Security Secure Boot Secure Storage Software IP Protection Trusted Execution Environment
Serial I/O	CAN I2C SPI UART USB
UART(SCI)	10
USB	2
USB 2.0	1
USB 3.0	1
Video Port (Configurable)	6+
Video Resolution/Frame Rate	1080p60
eCAP	3
eQEP	3

生态计划

RoHS	Compliant
Pb Free	Yes

设计套件和评估模块

Development Kits: TMDXIDK5728
AM572x Industrial Development Kit (IDK)
Lifecycle Status: Active (Recommended for new designs)
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Development Kits: TMDXIDK5718
AM571x Industrial Development Kit (IDK)
Lifecycle Status: Active (Recommended for new designs)
- 下载
Evaluation Modules & Boards: TMDSEVM572X
AM572x Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
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Evaluation Modules & Boards: TMDSCM572X
TMDSEVM572x Camera Module
Lifecycle Status: Active (Recommended for new designs)
- 下载
Development Kits: TMDXIDK57X-LCD
AM57x IDK LCD Kit
Lifecycle Status: Active (Recommended for new designs)

应用须知

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AM572x Thermal Considerations
PDF, 400 Kb, 档案已发布: Dec 6, 2016
This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature.
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TPS659037 Operation With Higher Capacitive Loading
PDF, 811 Kb, 档案已发布: Oct 7, 2015
This TPS659037 Operation With Higher Capacitive Loading application report addresses use-cases where external components demand a higher capacitive loading than the rating of the TPS659037 SMPS-outputs (57-ОјF maximum per phase). The specification of the device with a rating of nominal 47 ОјF and maximum of 57 ОјF holds true. Exceeding these values is at the risk of the user and requires thorough val
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TPS659037 Design Guide
PDF, 62 Kb, 档案已发布: Sep 21, 2015
This application note provides guidance on schematic design and can be used as a design review of applications using the TPS659037 power management IC (PMIC). This document describes recommended external components recommended connections of select signals and contains a design checklist. Prior to using this guide TI recommends reading the user's guide TPS659037 User's Guide to Power AM572x an
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TPS659037 Design Checklist (Rev. A)
ZIP, 45 Kb, 修订版: A, 档案已发布: Jan 13, 2016
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DSPLIB for Processor SDK RTOS
PDF, 461 Kb, 档案已发布: Nov 4, 2016
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AM572x GP EVM Power Simulations
PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
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EMIF Tools (Rev. A)
PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
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AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
PDF, 55 Kb, 档案已发布: Oct 6, 2016
When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
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Keystone EDMA FAQ
PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
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AM572x/AM571x Compatibility Guide (Rev. C)
PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
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Code Composer Studio Device Support Package
PDF, 87 Kb, 档案已发布: Nov 19, 2015
This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
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IODELAY Application Note for AM57xx Devices (Rev. A)
PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
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AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
Application Note 1281 Bumped Die (Flip Chip) Packages
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TI DSP Benchmarking
PDF, 62 Kb, 档案已发布: Jan 13, 2016
This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
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Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as вЂњprocessorsвЂќ, вЂњSystem-on-chipвЂќ, or вЂњSoCвЂќ). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
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Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
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High-Speed Interface Layout Guidelines (Rev. G)
PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

系列: AM5728 (5)

AM5728BABCX AM5728BABCXA AM5728BABCXEA XAM5728AABCXE XAM5728BABCXE

制造商分类

Semiconductors > Processors > Sitara Processors > ARM Cortex-A15 > AM57x