Datasheet Texas Instruments AM5728 — 数据表

制造商Texas Instruments
系列AM5728
Datasheet Texas Instruments AM5728

Sitara处理器

数据表

AM572x Sitaraв„ў Processors Silicon Revision 2.0 datasheet
PDF, 4.6 Mb, 修订版: C, 档案已发布: Jun 6, 2017
从文件中提取

价格

状态

AM5728BABCXAM5728BABCXAAM5728BABCXEAXAM5728AABCXEXAM5728BABCXE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesYesYesNo

打包

AM5728BABCXAM5728BABCXAAM5728BABCXEAXAM5728AABCXEXAM5728BABCXE
N12345
Pin760760760760760
Package TypeABCABCABCABCABC
Industry STD TermFCBGAFCBGAFCBGAFCBGAFCBGA
JEDEC CodeS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-NS-PBGA-N
Package QTY6060601
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingAM5728BABCXAM5728BABCXAAM5728BABCXEAXAM5728AABCXESITARATM
Width (mm)2323232323
Length (mm)2323232323
Thickness (mm)2.392.392.392.392.39
Pitch (mm).8.8.8.8.8
Max Height (mm)2.962.962.962.962.96
Mechanical Data下载下载下载下载下载

参数化

Parameters / ModelsAM5728BABCX
AM5728BABCX
AM5728BABCXA
AM5728BABCXA
AM5728BABCXEA
AM5728BABCXEA
XAM5728AABCXE
XAM5728AABCXE
XAM5728BABCXE
XAM5728BABCXE
ARM CPU2 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A152 ARM Cortex-A15
ARM MHz, Max.150015001500
ARM MHz (Max.)15001500
ARM MIPS, Max.105001050010500
ARM MIPS(Max.)1050010500
ApplicationCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment,Enterprise Systems,Industrial,Personal ElectronicsCommunications Equipment
Enterprise Systems
Industrial
Personal Electronics
Communications Equipment
Enterprise Systems
Industrial
Personal Electronics
Approx. Price (US$)40.47 | 1ku40.47 | 1ku
CAN222
CAN(#)22
Co-Processor, s2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS2 ARM Cortex-M4,4 PRU-ICSS
Co-Processor(s)2 ARM Cortex-M4
4 PRU-ICSS
2 ARM Cortex-M4
4 PRU-ICSS
DMA, Ch64-Ch EDMA64-Ch EDMA64-Ch EDMA
DMA(Ch)64-Ch EDMA64-Ch EDMA
DRAMDDR3,DDR3LDDR3,DDR3LDDR3,DDR3LDDR3(L)DDR3(L)
DSP2 C66x2 C66x2 C66x2 C66x2 C66x
DSP MHz, Max.750750750
DSP MHz (Max.)750750
Display Options1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out,3 LCD out1 HDMI out
3 LCD out
1 HDMI out
3 LCD out
EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000,2-Port 1Gb Switch,4-Port 10/100 PRU EMAC10/100/1000
2-Port 1Gb Switch
10/100/1000
2-Port 1Gb Switch
General Purpose Memory1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC, NAND flash,NOR Flash,SRAM)1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
1 16-bit (GPMC
NAND flash
NOR Flash
SRAM)
Graphics Acceleration2 3D,1 2D2 3D,1 2D2 3D,1 2D2 3D
1 2D
2 3D
1 2D
HDMI11111
I2C55555
IO Supply, V1.8,3.31.8,3.31.8,3.3
IO Supply(V)1.8
3.3
1.8
3.3
Industrial Protocols1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588,EtherCAT,EtherNet/IP,POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
1588
EtherCAT
EtherNet/IP
POWERLINK
PROFIBUS
PROFINET RT/IRT
SERCOS III
LCD33333
MMC/SD44444
McASP88888
On-Chip L1 Cache32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32KB (L1D and L1I ARM Cortex-A15)32 KB (ARM Cortex-A15)
32 KB (C66x)
32 KB (ARM Cortex-A15)
32 KB (C66x)
On-Chip L2 Cache2MB (ARM Coxtex-A15)2MB (ARM Coxtex-A15)2MB (ARM Coxtex-A15)1 MB (ARM Cortex-A15)
288 KB (C66x)
1 MB (ARM Cortex-A15)
288 KB (C66x)
Operating SystemsAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid,Integrity,Linux,Neutrino,Nucleus,TI-RTOS,VxWorks,Windows Embedded CEAndroid
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Android
Integrity
Linux
Nucleus
Neutrino
TI-RTOS
VxWorks
Windows Embedded CE
Operating Temperature Range, C-40 to 105,0 to 90-40 to 105,0 to 90-40 to 105,0 to 90
Operating Temperature Range(C)-40 to 105
0 to 90
-40 to 105
0 to 90
Other Hardware AccelerationCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto AcceleratorCrypto Accelerator
Other On-Chip Memory2.5 MB w/ECC2.5 MB w/ECC2.5 MB w/ECC2.5 MB w/ECC2.5 MB w/ECC
PCI/PCIe2 PCIe2 PCIe2 PCIe2 PCIe Gen 22 PCIe Gen 2
PWM, Ch333
PWM(Ch)33
Package GroupFCBGAFCBGAFCBGAFCBGAFCBGA
QSPI11111
RTC11111
RatingCatalogCatalogCatalogCatalogCatalog
SATA11111
SPI44444
Security EnablerCryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Cryptographic Acceleration
Debug Security
Device Identity
External Memory Protection
Initial Secure Programming
Physical Security
Secure Boot
Secure Storage
Software IP Protection
Trusted Execution Environment
Serial I/OCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN,I2C,SPI,UART,USBCAN
I2C
SPI
UART
USB
CAN
I2C
SPI
UART
USB
UART, SCI101010
UART(SCI)1010
USB22222
USB 2.011111
USB 3.011111
Video Port, Configurable6+6+6+
Video Port (Configurable)6+6+
Video Resolution/Frame Rate1080p601080p601080p601080p601080p60
eCAP33333
eQEP33333

生态计划

AM5728BABCXAM5728BABCXAAM5728BABCXEAXAM5728AABCXEXAM5728BABCXE
RoHSCompliantCompliantCompliantCompliantCompliant
Pb FreeYesYes

应用须知

  • AM572x Thermal Considerations
    PDF, 400 Kb, 档案已发布: Dec 6, 2016
    This application report discusses thermal performance of the Sitara AM572x series processors. Data presented demonstrates the effects of different thermal management strategies in terms of processor junction temperature and power consumption across CPU loading and ambient temperature.
  • TPS659037 Operation With Higher Capacitive Loading
    PDF, 811 Kb, 档案已发布: Oct 7, 2015
    This TPS659037 Operation With Higher Capacitive Loading application report addresses use-cases where external components demand a higher capacitive loading than the rating of the TPS659037 SMPS-outputs (57-ОјF maximum per phase). The specification of the device with a rating of nominal 47 ОјF and maximum of 57 ОјF holds true. Exceeding these values is at the risk of the user and requires thorough val
  • TPS659037 Design Guide
    PDF, 62 Kb, 档案已发布: Sep 21, 2015
    This application note provides guidance on schematic design and can be used as a design review of applications using the TPS659037 power management IC (PMIC). This document describes recommended external components recommended connections of select signals and contains a design checklist. Prior to using this guide TI recommends reading the user's guide TPS659037 User's Guide to Power AM572x an
  • TPS659037 Design Checklist (Rev. A)
    ZIP, 45 Kb, 修订版: A, 档案已发布: Jan 13, 2016
  • DSPLIB for Processor SDK RTOS
    PDF, 461 Kb, 档案已发布: Nov 4, 2016
  • AM572x GP EVM Power Simulations
    PDF, 22.4 Mb, 档案已发布: Oct 8, 2015
    The purpose of this application report is to present the flow, the environment settings and TI requirements used to perform the analysis of critical power nets of a platform using an application processor. The Power Delivery Network (PDN) performance is measured by extracting and analyzing three printed circuit board (PCB) parameters: DC resistivity, capacitor loop inductance, and broadband target
  • EMIF Tools (Rev. A)
    PDF, 207 Kb, 修订版: A, 档案已发布: Jun 5, 2017
    At the center of every application is the need for memory. With limited on-chip processor memory, external memory serves as a solution for large software systems and data storage, and an unstable external memory interface can result in system failures or hinder software development. To prevent potential system level anomalies and ensure robust systems, hardware must be configured correctly and tes
  • AM57x Processor SDK Linux: Customization of Multicore Application to Run on a Ne
    PDF, 55 Kb, 档案已发布: Oct 6, 2016
    When customers develop applications that use multiple programmable cores on the AM57x they require a clear understanding of roles and configurations of multiple software (SW) components such as IPC, CMEM, CMA, Linuxв„ў, and SYS/BIOS on slave cores, in order to arrive at correct configuration for their application. This application report describes memory utilization schemes by A15/DSP/IPU, how they
  • Keystone EDMA FAQ
    PDF, 1.3 Mb, 档案已发布: Sep 1, 2016
    This document is a collection of frequently asked questions (FAQs) on enhanced direct memory access (EDMA) on KeyStoneв„ў I (KS1) and KeyStone II (KS2) devices, along with useful collateral and software reference links.
  • AM572x/AM571x Compatibility Guide (Rev. C)
    PDF, 182 Kb, 修订版: C, 档案已发布: Feb 22, 2016
    This application report provides a summary of the differences between AM572x Silicon Revision 1.1/2.0 and AM571x Silicon Revision 1.0 high-performance ARMВ® devices.
  • Code Composer Studio Device Support Package
    PDF, 87 Kb, 档案已发布: Nov 19, 2015
    This document gives a brief description of download location and installation procedures of the device Chip Support Package (CSP) for Code Composer Studioв„ў (CCS).
  • IODELAY Application Note for AM57xx Devices (Rev. A)
    PDF, 785 Kb, 修订版: A, 档案已发布: Aug 3, 2017
  • AN-1281 Bumped Die (Flip Chip) Packages (Rev. A)
    PDF, 2.2 Mb, 修订版: A, 档案已发布: May 1, 2004
    Application Note 1281 Bumped Die (Flip Chip) Packages
  • TI DSP Benchmarking
    PDF, 62 Kb, 档案已发布: Jan 13, 2016
    This application report provides benchmarks for the C674x DSP core, the C66x DSP core and the ARMВ®CortexВ®-A15 core. This document also shows how to reproduce these benchmarks on specific hardware platforms.
  • Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
    PDF, 324 Kb, 修订版: A, 档案已发布: Aug 17, 2016
    This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, 修订版: G, 档案已发布: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

模型线

制造商分类

  • Semiconductors> Processors> Sitara Processors> ARM Cortex-A15> AM57x