Datasheet Texas Instruments CC2560ARVMT — 数据表
| 制造商 | Texas Instruments |
| 系列 | CC2560 |
| 零件号 | CC2560ARVMT |
Bluetooth®CC2560控制器76-VQFNP-MR -40至85
数据表
价格
状态
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 76 |
| Package Type | RVM |
| Industry STD Term | VQFNP-MR |
| JEDEC Code | S-PQFP-N |
| Package QTY | 250 |
| Carrier | SMALL T&R |
| Device Marking | CC2560A |
| Width (mm) | 8 |
| Length (mm) | 8 |
| Thickness (mm) | .85 |
| Pitch (mm) | .6 |
| Max Height (mm) | .9 |
| Mechanical Data | 下载 |
参数化
| Data Rate(Max) | 3000 kbps |
| Device Type | Smart RF Transceiver |
| Frequency Bands | 2400 MHz |
| Operating Temperature Range | -40 to 85 C |
| RX Current (Lowest) | 35 mA |
| Rating | Catalog |
| Sensitivity (Best) | -95 dBm |
| Special Features | Classic Bluetooth |
| TX Power(Max) | 12 dBm |
| Technology | Bluetooth |
| Throughput(Max) | 3 Mbps |
生态计划
| RoHS | Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: EK-TM4C1294XL
ARMВ® CortexВ®-M4F-Based MCU TM4C1294 Connected LaunchPadв„ў
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC256XSTBTBLESW
TI Dual-mode BluetoothВ® Stack on STM32F4 MCUs
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5529
MSP430F5529 USB Experimenter’s Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC2564MODNEM
Dual-mode BluetoothВ® CC2564 module evaluation board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC256XQFNEM
Dual-mode BluetoothВ® CC2564 evaluation board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5438
MSP430F5438 Experimenter Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: EK-TM4C123GXL
ARMВ® CortexВ®-M4F Based MCU TM4C123G LaunchPadВ™ Evaluation Kit
Lifecycle Status: Active (Recommended for new designs) - Development Kits: DK-TM4C123G
TM4C123G USB+CAN Development Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC2564MODAEM
Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
Lifecycle Status: Active (Recommended for new designs) - Development Kits: DK-TM4C129X
IoT Enabled ARMВ® CortexВ®-M4F MCU TM4C129X Connected Development Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: EK-TM4C129EXL
ARMВ® CortexВ®-M4F-Based MCU TM4C129E Crypto Connected LaunchPadв„ў for IoT Applications
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BOOST-CC2564MODA
Dual-mode BluetoothВ® CC2564 module with integrated antenna BoosterPackВ™ plug-in module
Lifecycle Status: Active (Recommended for new designs)
应用须知
- CC256XQFN PCB Guidelines (Rev. B)PDF, 1.8 Mb, 修订版: B, 档案已发布: Oct 28, 2016
- Using TI Technology to Simplify Bluetooth Pairing Via NFCPDF, 3.0 Mb, 档案已发布: Nov 28, 2011
Bluetooth pairing usually involves some level of user interaction to confirm the identity of the user and/or the devices themselves. There are many pairing mechanisms available across the versions of Bluetooth (v2.0 through v4.0). This process is typically lengthy and sometimes confusing to the user, and so this application report is aimed at showing TI technology developers details on implementin - AN058 -- Antenna Selection Guide (Rev. B)PDF, 1.8 Mb, 修订版: B, 档案已发布: Oct 6, 2010
- DN035 -- Antenna Quick Guide (Rev. A)PDF, 138 Kb, 修订版: A, 档案已发布: Feb 12, 2013
- QFN and SON PCB Attachment (Rev. B)PDF, 821 Kb, 修订版: B, 档案已发布: Aug 24, 2018
模型线
系列: CC2560 (3)
- CC2560ARVMR CC2560ARVMT CC2560BRVMR
制造商分类
- Semiconductors > Wireless Connectivity > Companion Wireless Solutions > Smart RF Transceivers