Datasheet Texas Instruments CC2564MODNCMOET — 数据表
| 制造商 | Texas Instruments |
| 系列 | CC2564MODN |
| 零件号 | CC2564MODNCMOET |
双模Bluetooth®CC2564模块33-QFM -30至85
数据表
CC2564MODx BluetoothВ® Host Controller Interface (HCI) Module datasheet
PDF, 16.9 Mb, 修订版: E, 档案已发布: Jan 16, 2016
从文件中提取
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
打包
| Pin | 33 |
| Package Type | MOE |
| Package QTY | 250 |
| Carrier | SMALL T&R |
| Width (mm) | 7 |
| Length (mm) | 7 |
| Thickness (mm) | 1.4 |
| Mechanical Data | 下载 |
参数化
| Bluetooth Standard | Bluetooth Smart (Bluetooth low energy),Classic Bluetooth,Dual-mode Bluetooth |
| Data Rate(Max) | 3000 kbps |
| Device Type | Smart RF Transceiver,Module |
| Package Group | QFM |
| Package Size: mm2:W x L | See datasheet (QFM) PKG |
| Rating | Catalog |
| Special Features | N/A |
| Technology | Dual-mode Bluetooth |
| Throughput(Max) | 3 Mbps |
生态计划
| RoHS | Not Compliant |
设计套件和评估模块
- Evaluation Modules & Boards: DLPNIRNANOEVM
DLPВ® NIRscanВ™ Nano Evaluation Module
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC256XSTBTBLESW
TI Dual-mode BluetoothВ® Stack on STM32F4 MCUs
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5529
MSP430F5529 USB Experimenter’s Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BT-MSPAUDSOURCE
Bluetooth and MSP430 Audio Source Reference Design Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC2564MODNEM
Dual-mode BluetoothВ® CC2564 module evaluation board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC256XQFNEM
Dual-mode BluetoothВ® CC2564 evaluation board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-EXP430F5438
MSP430F5438 Experimenter Board
Lifecycle Status: Active (Recommended for new designs) - Development Kits: DK-TM4C123G
TM4C123G USB+CAN Development Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: CC2564MODAEM
Dual-mode BluetoothВ® CC2564 Module with Integrated Antenna Evaluation Board
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: BOOST-CC2564MODA
Dual-mode BluetoothВ® CC2564 module with integrated antenna BoosterPackВ™ plug-in module
Lifecycle Status: Active (Recommended for new designs) - Development Kits: DK-TM4C129X
IoT Enabled ARMВ® CortexВ®-M4F MCU TM4C129X Connected Development Kit
Lifecycle Status: Active (Recommended for new designs)
应用须知
- Using TI Technology to Simplify Bluetooth Pairing Via NFCPDF, 3.0 Mb, 档案已发布: Nov 28, 2011
Bluetooth pairing usually involves some level of user interaction to confirm the identity of the user and/or the devices themselves. There are many pairing mechanisms available across the versions of Bluetooth (v2.0 through v4.0). This process is typically lengthy and sometimes confusing to the user, and so this application report is aimed at showing TI technology developers details on implementin - AN058 -- Antenna Selection Guide (Rev. B)PDF, 1.8 Mb, 修订版: B, 档案已发布: Oct 6, 2010
- DN035 -- Antenna Quick Guide (Rev. A)PDF, 138 Kb, 修订版: A, 档案已发布: Feb 12, 2013
模型线
系列: CC2564MODN (2)
- CC2564MODNCMOER CC2564MODNCMOET
制造商分类
- Semiconductors > Wireless Connectivity > Dual Mode Bluetooth (BLE/BT) > CC2564