Data sheet acquired from Harris Semiconductor
SCHS048C -Revised October 2003 The CD4054B-, CD4055B-, and CD4056B-series
types are supplied in 16-lead dual-in-line plastic
packages (E suffix), 16-lead small-outline
packages (M, M96, MT, and NSR suffixes), and
16-lead thin shrink small-outline packages (PW
and PWR suffixes). The CD4054B-and
CD4056B-series types also are supplied in 16-lead
hermetic dual-in-line ceramic packages (F3A
suffix). Copyright В© 2003, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 15-Apr-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD4054BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4054BE CD4054BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type -55 to 125 CD4054BF3A CD4054BM ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4054BM CD4054BM96 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4054BM CD4054BPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM054B CD4055BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4055BE CD4055BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD4055BE CD4055BM ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CD4055BM CD4055BPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 CM055B CD4056BE ACTIVE PDIP N 16 25 Pb-Free …
