Datasheet Texas Instruments CD74AC373M96 — 数据表

制造商	Texas Instruments
系列	CD74AC373
零件号	CD74AC373M96

具有三态输出的八路透明锁存器20-SOIC -55至125

数据表

下载

PDF, 1.3 Mb, 档案已发布: Dec 3, 1998

从文件中提取

Data sheet acquired from Harris Semiconductor
SCHS289 This data sheet is applicable to the CD54/74AC373, CD54/74ACT373, and CD54ACT533. The CD74AC533 and CD74ACT533 were not
acquired from Harris Semiconductor. PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION
Orderable Device Status
(1) Package Type Package Pins Package
Drawing
Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (В°C) Device Marking
(4/5) CD54AC373F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54AC373F3A CD54ACT373F3A ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 CD54ACT373F3A CD74AC373E ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74AC373E CD74AC373M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC373M CD74AC373M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC373M CD74AC373MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 AC373M CD74ACT373E ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74ACT373E CD74ACT373EE4 ACTIVE PDIP N 20 20 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -55 to 125 CD74ACT373E CD74ACT373M ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT373M CD74ACT373M96 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT373M CD74ACT373M96E4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT373M CD74ACT373MG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -55 to 125 ACT373M (1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device. …

价格

状态

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

打包

Pin	20
Package Type	DW
Industry STD Term	SOIC
JEDEC Code	R-PDSO-G
Package QTY	2000
Carrier	LARGE T&R
Device Marking	AC373M
Width (mm)	7.5
Length (mm)	12.8
Thickness (mm)	2.35
Pitch (mm)	1.27
Max Height (mm)	2.65
Mechanical Data	下载

参数化

3-State Output	Yes
Bits	8
F @ Nom Voltage(Max)	100 Mhz
ICC @ Nom Voltage(Max)	0.08 mA
Operating Temperature Range	-55 to 125 C
Output Drive (IOL/IOH)(Max)	24/-24 mA
Package Group	SOIC
Package Size: mm2:W x L	20SOIC: 132 mm2: 10.3 x 12.8(SOIC) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	AC
VCC(Max)	5.5 V
VCC(Min)	1.5 V
Voltage(Nom)	1.5,3.3,5 V
tpd @ Nom Voltage(Max)	96,10.8,7.7 ns

生态计划

RoHS

Compliant

应用须知

下载
Power-Up Behavior of Clocked Devices (Rev. A)
PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015
下载
Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
PDF, 43 Kb, 档案已发布: Apr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

模型线

系列: CD74AC373 (4)

CD74AC373E CD74AC373M CD74AC373M96 CD74AC373MG4

制造商分类

Semiconductors > Logic > Flip-Flop/Latch/Register > D-Type Latch