Datasheet Texas Instruments CDC516 — 数据表
制造商 | Texas Instruments |
系列 | CDC516 |
具有三态输出的3.3V锁相环时钟驱动器
数据表
价格
状态
CDC516DGG | CDC516DGGG4 | CDC516DGGR | CDC516DGGRG4 | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | Yes | Yes | No |
打包
CDC516DGG | CDC516DGGG4 | CDC516DGGR | CDC516DGGRG4 | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 48 | 48 | 48 | 48 |
Package Type | DGG | DGG | DGG | DGG |
Industry STD Term | TSSOP | TSSOP | TSSOP | TSSOP |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 40 | 40 | 2000 | 2000 |
Carrier | TUBE | TUBE | LARGE T&R | LARGE T&R |
Device Marking | CDC516 | CDC516 | CDC516 | CDC516 |
Width (mm) | 6.1 | 6.1 | 6.1 | 6.1 |
Length (mm) | 12.5 | 12.5 | 12.5 | 12.5 |
Thickness (mm) | 1.15 | 1.15 | 1.15 | 1.15 |
Pitch (mm) | .5 | .5 | .5 | .5 |
Max Height (mm) | 1.2 | 1.2 | 1.2 | 1.2 |
Mechanical Data | 下载 | 下载 | 下载 | 下载 |
参数化
Parameters / Models | CDC516DGG | CDC516DGGG4 | CDC516DGGR | CDC516DGGRG4 |
---|---|---|---|---|
Absolute Jitter (Peak-to-Peak Cycle or Period Jitter), ps | 200 | 200 | 200 | 200 |
Number of Outputs | 16 | 16 | 16 | 16 |
Operating Frequency Range(Max), MHz | 125 | 125 | 125 | 125 |
Operating Frequency Range(Min), MHz | 25 | 25 | 25 | 25 |
Package Group | TSSOP | TSSOP | TSSOP | TSSOP |
Package Size: mm2:W x L, PKG | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) |
Rating | Catalog | Catalog | Catalog | Catalog |
VCC, V | 3.3 | 3.3 | 3.3 | 3.3 |
t(phase error), ps | 400 | 400 | 400 | 400 |
tsk(o), ps | 200 | 200 | 200 | 200 |
生态计划
CDC516DGG | CDC516DGGG4 | CDC516DGGR | CDC516DGGRG4 | |
---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant |
应用须知
- High Speed Clock Distribution Design Techniques for CDC 509/516/2509/2510/2516 (Rev. A)PDF, 109 Kb, 修订版: A, 档案已发布: Sep 23, 1998
The memory bandwidth of high performance microprocessors is increasing at a rapid rate and the future memory bandwidth requirements are expected to keep increasing. The bandwidth requirements of RAM will be satisfied in the near term by using Synchronous DRAM. The need to drive multiple DRAM chips at high speeds with low skew necessitates the use of clock distribution devices with Phase Locked Loo
模型线
系列: CDC516 (4)
制造商分类
- Semiconductors> Clock and Timing> Clock Buffers> Zero Delay Buffers