Datasheet Texas Instruments ISO5851 — 数据表
制造商 | Texas Instruments |
系列 | ISO5851 |
具有高CMTI和米勒钳位的增强型隔离式IGBT栅极驱动器
数据表
ISO5851 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.5 Mb, 修订版: B, 档案已发布: Jan 16, 2017
从文件中提取
价格
状态
ISO5851DW | ISO5851DWR | |
---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | Yes |
打包
ISO5851DW | ISO5851DWR | |
---|---|---|
N | 1 | 2 |
Pin | 16 | 16 |
Package Type | DW | DW |
Industry STD Term | SOIC | SOIC |
JEDEC Code | R-PDSO-G | R-PDSO-G |
Package QTY | 40 | 2000 |
Carrier | TUBE | LARGE T&R |
Device Marking | ISO5851 | ISO5851 |
Width (mm) | 7.5 | 7.5 |
Length (mm) | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 |
Pitch (mm) | 1.27 | 1.27 |
Max Height (mm) | 2.65 | 2.65 |
Mechanical Data | 下载 | 下载 |
参数化
Parameters / Models | ISO5851DW | ISO5851DWR |
---|---|---|
DIN V VDE V 0884-10 Working Voltage, Vpk | 2121 | 2121 |
DIN V VDE V 0884-10 Transient Overvoltage Rating, Vpk | 8000 | 8000 |
Enable/Disable Function | N/A | N/A |
Input VCC(Max), V | 5.5 | 5.5 |
Input VCC(Min), V | 3 | 3 |
Isolation Rating, Vrms | 5700 | 5700 |
Number of Channels | 1 | 1 |
Operating Temperature Range, C | -40 to 125 | -40 to 125 |
Output VCC/VDD(Max), V | 30 | 30 |
Output VCC/VDD(Min), V | 15 | 15 |
Package Group | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Peak Output Current, A | 5 | 5 |
Power Switch | IGBT,SiCFET | IGBT,SiCFET |
Prop Delay, ns | 76 | 76 |
Prop Delay(Max), ns | 110 | 110 |
生态计划
ISO5851DW | ISO5851DWR | |
---|---|---|
RoHS | Compliant | Compliant |
应用须知
- Common-mode transient immunity for isolated gate driversPDF, 152 Kb, 档案已发布: Oct 30, 2015
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, 档案已发布: Oct 30, 2015
- 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, 档案已发布: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, 档案已发布: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Isolation GlossaryPDF, 52 Kb, 档案已发布: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, 修订版: A, 档案已发布: Nov 4, 2014
模型线
系列: ISO5851 (2)
制造商分类
- Semiconductors> Isolation> Isolated Gate Driver