Datasheet Texas Instruments ISO7321-Q1 — 数据表
制造商 | Texas Instruments |
系列 | ISO7321-Q1 |
汽车类低功耗双通道1/1数字隔离器
数据表
ISO732x-Q1 Robust EMC, Low Power, Dual-Channel Digital Isolators datasheet
PDF, 1.3 Mb, 档案已发布: Nov 16, 2015
从文件中提取
价格
状态
ISO7321CQDQ1 | ISO7321CQDRQ1 | ISO7321FCQDQ1 | ISO7321FCQDRQ1 | |
---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | Yes | Yes | No |
打包
ISO7321CQDQ1 | ISO7321CQDRQ1 | ISO7321FCQDQ1 | ISO7321FCQDRQ1 | |
---|---|---|---|---|
N | 1 | 2 | 3 | 4 |
Pin | 8 | 8 | 8 | 8 |
Package Type | D | D | D | D |
Industry STD Term | SOIC | SOIC | SOIC | SOIC |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 75 | 2500 | 75 | 2500 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R |
Device Marking | 7321Q | 7321Q | 7321FQ | 7321FQ |
Width (mm) | 3.91 | 3.91 | 3.91 | 3.91 |
Length (mm) | 4.9 | 4.9 | 4.9 | 4.9 |
Thickness (mm) | 1.58 | 1.58 | 1.58 | 1.58 |
Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
Max Height (mm) | 1.75 | 1.75 | 1.75 | 1.75 |
Mechanical Data | 下载 | 下载 | 下载 | 下载 |
参数化
Parameters / Models | ISO7321CQDQ1 | ISO7321CQDRQ1 | ISO7321FCQDQ1 | ISO7321FCQDRQ1 |
---|---|---|---|---|
Data Rate(Max), Mbps | 25 | 25 | 25 | 25 |
Default Output | High | High | Low | Low |
Forward/Reverse Channels | 1/1 | 1/1 | 1/1 | 1/1 |
Integrated Isolated Power | No | No | No | No |
Isolation Rating, Vrms | 3000 | 3000 | 3000 | 3000 |
Number of Channels | 2 | 2 | 2 | 2 |
Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
Package Group | SOIC | SOIC | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
Propagation Delay, ns | 31 | 31 | 31 | 31 |
Propagation Delay(Typ), ns | 31 | 31 | 31 | 31 |
Rating | Automotive | Automotive | Automotive | Automotive |
Surge Voltage Rating, Vpk | 6000 | 6000 | 6000 | 6000 |
VCC(Max), V | 5 | 5 | 5 | 5 |
VCC(Min), V | 3.3 | 3.3 | 3.3 | 3.3 |
生态计划
ISO7321CQDQ1 | ISO7321CQDRQ1 | ISO7321FCQDQ1 | ISO7321FCQDRQ1 | |
---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant |
应用须知
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, 档案已发布: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
模型线
系列: ISO7321-Q1 (4)
制造商分类
- Semiconductors> Isolation> Digital Isolators