具有精确使能的5A SIMPLE SWITCHER,降压稳压器
PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
Application Note 643 EMI/RFI Board Design
PDF, 83 Kb, 修订版: B, 档案已发布: May 6, 2013
This application report discusses an over voltage protection circuit for automotive load dump.
PDF, 219 Kb, 档案已发布: Sep 19, 2005
PDF, 558 Kb, 修订版: B, 档案已发布: Apr 23, 2013
This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application note provides thermal power analysis techniques for analyzing the power IC.
PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
PDF, 2.3 Mb, 修订版: A, 档案已发布: Apr 24, 2013
This application note describes the TO–263 THIN Package.
PDF, 153 Kb, 修订版: A, 档案已发布: May 6, 2013
The development of realistic predictions to assist the power supply engineer during the control loop design process is facilitated in this application report by appropriate small-signal and bode plot analysis, the validity of which is verified through simulation results.
PDF, 72 Kb, 修订版: A, 档案已发布: Apr 23, 2013
Power management applications, typically located on the front line of the automotive electronics system,can be subject to wide input operating voltage extremes resulting from load-dump and cold-crankingconditions. Careful selection of the power management electronics can provide added margin andprotection to the automotive electronics system. The simplest design is provided by a power manage
PDF, 512 Kb, 修订版: A, 档案已发布: Sep 12, 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
This application note discusses stresses in wide input DC-DC converters.
PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP