Datasheet Texas Instruments LMR62421 — 数据表

制造商	Texas Instruments
系列	LMR62421

数据表

价格

状态

打包

参数化

Parameters / Models	LMR62421XMF/NOPB	LMR62421XMFE/NOPB	LMR62421XMFX/NOPB	LMR62421XSD/NOPB	LMR62421XSDE/NOPB	LMR62421XSDX/NOPB
Duty Cycle(Max), %	96	96	96	96	96	96
Iq(Typ), mA	7	7	7	7	7	7
Operating Temperature Range, C	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125	-40 to 125
Package Group	SOT-23	SOT-23	SOT-23	WSON	WSON	WSON
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Regulated Outputs	1	1	1	1	1	1
Special Features	Enable	Enable	Enable	Enable	Enable	Enable
Switch Current Limit(Min), A	2.1	2.1	2.1	2.1	2.1	2.1
Switch Current Limit(Typ), A	3	3	3	3	3	3
Switching Frequency(Max), kHz	1600	1600	1600	1600	1600	1600
Switching Frequency(Min), kHz	1600	1600	1600	1600	1600	1600
Type	Converter	Converter	Converter	Converter	Converter	Converter
Vin(Max), V	5.5	5.5	5.5	5.5	5.5	5.5
Vin(Min), V	2.7	2.7	2.7	2.7	2.7	2.7
Vout(Max), V	24	24	24	24	24	24
Vout(Min), V	3	3	3	3	3	3

生态计划

应用须知

• 下载
  Softstart Using Constant Current Constant Voltage Approach
  PDF, 337 Kb, 档案已发布: Jul 24, 2015
  In many systems backup power is provided either by batteries or simply by a large value capacitor. Inthese applications the capacitor would only provide the current when the primary power source fails.Further, these applications are usually for light load currents. During normal operation the backupcapacitors are kept charged up by a DC/DC converter. The challenge involved in an application
• 下载
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• 下载
  Working With Boost Converters
  PDF, 159 Kb, 档案已发布: Jun 15, 2015
  This brief note highlights some of the more common pitfalls when using boost regulators. These includemaximum achievable output current and voltage, short circuit behavior and basic layout issues. It isassumed that the reader is familiar with the basic operation of a boost regulator.
• 下载
  Input and Output Capacitor Selection
  PDF, 219 Kb, 档案已发布: Sep 19, 2005
• 下载
  Basic Calculation of a Boost Converter's Power Stage (Rev. C)
  PDF, 186 Kb, 修订版: C, 档案已发布: Jan 8, 2014
  This application note gives the equations to calculate the power stage of a boost converter built with an IC with integrated switch and operating in continuous conduction mode. It is not intended to give details on the functionality of a boost converter (see Reference 1) or how to compensate a converter. See the references at the end of this document if more detail is needed.
• 下载
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• 下载
  AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
  PDF, 1.4 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note provides thermal power analysis techniques for analyzing the power IC.
• 下载
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• 下载
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
• 下载
  Inverted SEPIC Made SIMPLE
  PDF, 408 Kb, 档案已发布: Jul 31, 2015
  There can be quite a few applications that require a conversion from a negative input voltage to a negativeoutput voltage and there are a few ways to go about doing it. The telecom industry is one such examplewhere the rails are usually negative. This design space along with being limited is not well explored. In thisapplication note we will go over the use of an integrated boost regulator i
• 下载
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• 下载
  Understanding Boost Power Stages In Switchmode Power Supplies
  PDF, 149 Kb, 档案已发布: Mar 4, 1999
  A switching power supply consists of the power stage and the control circuit. The power stage performs the basic power conversion from the input voltage to the output voltage and includes switches and the output filter. This report addresses the boost power stage only and does not cover control circuits. The report includes detailed steady-stage and small-signal analysis of the boost power stage o
• 下载
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• 下载
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• 下载
  AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
  PDF, 427 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application note discusses stresses in wide input DC-DC converters.
• 下载
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

模型线

制造商分类

• Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Up (Boost)> Boost Converter (Integrated Switch)