Datasheet Texas Instruments LMZ10501 — 数据表

制造商	Texas Instruments
系列	LMZ10501

数据表

价格

状态

打包

参数化

Parameters / Models	LMZ10501SILR	LMZ10501SILT
Iout(Max), A	1	1
Iq(Typ), mA	6.5	6.5
Operating Temperature Range, C	-40 to 125	-40 to 125
Package Type	MicroSiP (LGA)	MicroSiP (LGA)
Regulated Outputs	1	1
Soft Start	Fixed	Fixed
Special Features	EMI Tested,Enable	EMI Tested,Enable
Switching Frequency(Max), kHz	2250	2250
Switching Frequency(Min), kHz	1750	1750
Switching Frequency(Typ), kHz	2000	2000
Vin(Max), V	5.5	5.5
Vin(Min), V	2.7	2.7
Vout(Max), V	3.6	3.6
Vout(Min), V	0.6	0.6

生态计划

应用须知

• 下载
  AN-1412 Micro SMDxt Wafer Level Chip Scale Package (Rev. K)
  PDF, 6.3 Mb, 修订版: K, 档案已发布: Apr 23, 2013
  Micro SMDxt is a wafer level CSP (WLCSP) with the following features:Package size equal to die sizeSmallest footprint per I/O countNo need for underfill materialInterconnect layout available in 0.4 mm or 0.5 mm pitchNo interposer between the silicon IC and the printed circuit board
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  AN-2168 LMZ10501 and LMZ10500 SIMPLE SWITCHER Nano Module EMI Performance (Rev. A)
  PDF, 403 Kb, 修订版: A, 档案已发布: Apr 23, 2013
  The LMZ10501 and LMZ10500 nano modules offer excellent EMI performance. The evaluation board withthe default components complies with the CISPR 22 Class B radiated emissions standard. Adding twosmall 0.1ОјF 0805 input capacitors results in CISPR 25 Class 5 radiated emissions standard compliance.The addition of a small LC filter (1ОјH and 1ОјF) to the input of the default evaluation board result
• 下载
  AN-2169 LMZ10501 and LMZ10500 SIMPLE SWITCHER Nano Module (Rev. A)
  PDF, 298 Kb, 修订版: A, 档案已发布: Apr 23, 2013
  The LMZ10501 and LMZ10500 SIMPLE SWITCHER nano modules are easy-to-use DC-DC solutionsoptimized for space-constrained applications. The LMZ10501 is capable of driving up to 1A load withexcellent power conversion efficiency, line and load regulation. The LMZ10500 is a 650mA version moduleand is pin-to-pin compatible with the LMZ10501.
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  Industrial-strength design considerations to prevent thermal and EMI damage
  PDF, 282 Kb, 档案已发布: Apr 11, 2014
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  AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)
  PDF, 13.7 Mb, 修订版: AG, 档案已发布: Aug 12, 2015
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  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Kb, 档案已发布: Aug 19, 2007
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  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• 下载
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
  Application Note 643 EMI/RFI Board Design
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
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  Input and Output Capacitor Selection
  PDF, 219 Kb, 档案已发布: Sep 19, 2005

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制造商分类

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module