Datasheet Texas Instruments LMZ30606 — 数据表

制造商Texas Instruments
系列LMZ30606
Datasheet Texas Instruments LMZ30606

采用小型QFN封装的SIMPLESWITCHER®®2.95V至6V,6A电源模块

数据表

LMZ30606 6-A SIMPLE SWITCHERВ® Power Module with 2.95V-6V Input in QFN Package datasheet
PDF, 1.5 Mb, 修订版: A, 档案已发布: Jun 7, 2017
从文件中提取

价格

状态

LMZ30606RKGRLMZ30606RKGT
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNo

打包

LMZ30606RKGRLMZ30606RKGT
N12
Pin3939
Package TypeRKGRKG
Industry STD TermB1QFNB1QFN
JEDEC CodeR-PQFP-NR-PQFP-N
Package QTY500250
CarrierLARGE T&RSMALL T&R
Device Marking54618LMZ30606
Width (mm)99
Length (mm)1111
Thickness (mm)2.82.8
Pitch (mm).9.9
Max Height (mm)2.92.9
Mechanical Data下载下载

参数化

Parameters / ModelsLMZ30606RKGR
LMZ30606RKGR
LMZ30606RKGT
LMZ30606RKGT
Iout(Max), A66
Operating Temperature Range, C-40 to 85-40 to 85
Package Size: mm2:W x L, PKG39B1QFN: 99 mm2: 9 x 11(B1QFN)39B1QFN: 99 mm2: 9 x 11(B1QFN)
Package TypeQFNQFN
Regulated Outputs11
Soft StartAdjustableAdjustable
Special FeaturesEMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,TrackingEMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking
Switching Frequency(Max), kHz20002000
Switching Frequency(Min), kHz500500
Switching Frequency(Typ), kHz12501250
Vin(Max), V66
Vin(Min), V2.952.95
Vout(Max), V3.63.6
Vout(Min), V0.80.8

生态计划

LMZ30606RKGRLMZ30606RKGT
RoHSNot CompliantNot Compliant

应用须知

  • Adjusting LMZ3 Output Voltage with LM10010/1
    PDF, 87 Kb, 档案已发布: Feb 11, 2014
    ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
  • Working With QFN Power Modules (Rev. A)
    PDF, 1.7 Mb, 修订版: A, 档案已发布: Jun 8, 2017
    TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
  • Soldering Requirements for BQFN Packages (Rev. B)
    PDF, 737 Kb, 修订版: B, 档案已发布: Jun 8, 2017
    This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
  • Uninterruptible Synchronization Clock Circuit
    PDF, 74 Kb, 档案已发布: Nov 22, 2013
  • Understanding and Applying Current-Mode Control Theory
    PDF, 409 Kb, 档案已发布: Aug 19, 2007
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, 修订版: B, 档案已发布: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, 修订版: C, 档案已发布: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, 修订版: C, 档案已发布: Apr 19, 2016
  • QFN and SON PCB Attachment (Rev. B)
    PDF, 821 Kb, 修订版: B, 档案已发布: Aug 24, 2018
  • Input and Output Capacitor Selection
    PDF, 219 Kb, 档案已发布: Sep 19, 2005

模型线

系列: LMZ30606 (2)

制造商分类

  • Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module