Datasheet Texas Instruments LMZ31704 — 数据表

制造商	Texas Instruments
系列	LMZ31704

数据表

价格

状态

打包

参数化

Parameters / Models	LMZ31704RVQR	LMZ31704RVQT
Iout(Max), A	4	4
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	42B3QFN: 100 mm2: 10 x 10(B3QFN)	42B3QFN: 100 mm2: 10 x 10(B3QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency
Switching Frequency(Max), kHz	1200	1200
Switching Frequency(Min), kHz	200	200
Switching Frequency(Typ), kHz	1000	1000
Vin(Max), V	17	17
Vin(Min), V	2.95	2.95
Vout(Max), V	5.5	5.5
Vout(Min), V	0.6	0.6

生态计划

应用须知

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  The LMZ31710 power module has been designed and characterized for operation at output voltages from0.6 V to 5.5 V. However, several applications require higher voltages than the standard point-of-loadvoltages that the LMZ31710 is designed for. Following the guidance in this application note, theLMZ31710 can be used for output voltages up to 9.5 V. All data included in this application note h
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  Power Module MSL Ratings
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  All semiconductor devices, including power modules that have a moisture sensitivity level (MSL) rating and a peak reflow classification, which provides needed information when manufacturing with the device. This application report helps to explain these ratings.
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  PDF, 38 Kb, 档案已发布: Jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
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  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
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  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
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  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, 修订版: B, 档案已发布: Aug 24, 2018
• 下载
  Input and Output Capacitor Selection
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模型线

制造商分类

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module