Datasheet Texas Instruments LMZ31710 — 数据表

制造商	Texas Instruments
系列	LMZ31710

数据表

价格

状态

打包

参数化

Parameters / Models	LMZ31710RVQR	LMZ31710RVQT
Iout(Max), A	10	10
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	42B3QFN: 100 mm2: 10 x 10(B3QFN)	42B3QFN: 100 mm2: 10 x 10(B3QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency
Switching Frequency(Max), kHz	1200	1200
Switching Frequency(Min), kHz	200	200
Switching Frequency(Typ), kHz	1000	1000
Vin(Max), V	17	17
Vin(Min), V	2.95	2.95
Vout(Max), V	5.5	5.5
Vout(Min), V	0.6	0.6

生态计划

应用须知

• 下载
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  The LMZ31710 power module has been designed and characterized for operation at output voltages from0.6 V to 5.5 V. However, several applications require higher voltages than the standard point-of-loadvoltages that the LMZ31710 is designed for. Following the guidance in this application note, theLMZ31710 can be used for output voltages up to 9.5 V. All data included in this application note h
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  LMZ31710, LMZ31707, LMZ31704 Parallel
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  The LMZ31710 is a 2.95-V to 17-V input, 10-A output, integrated power solution which integrates the PWM controller, power MOSFETs, inductor and passives in a low-profile, QFN package. For applications requiring greater than 10 A, it is possible to parallel up to six LMZ31710 devices by following the recommendations in this paper.
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  Power Module MSL Ratings
  PDF, 137 Kb, 档案已发布: Jan 20, 2017
  All semiconductor devices, including power modules that have a moisture sensitivity level (MSL) rating and a peak reflow classification, which provides needed information when manufacturing with the device. This application report helps to explain these ratings.
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  PDF, 38 Kb, 档案已发布: Jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
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  PDF, 87 Kb, 档案已发布: Feb 11, 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
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  PDF, 1.7 Mb, 修订版: A, 档案已发布: Jun 8, 2017
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  Soldering Requirements for BQFN Packages (Rev. B)
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  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
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  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, 档案已发布: Nov 22, 2013
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, 修订版: B, 档案已发布: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  PDF, 3.6 Mb, 修订版: A, 档案已发布: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, 修订版: C, 档案已发布: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
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  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, 修订版: B, 档案已发布: Aug 24, 2018
• 下载
  Input and Output Capacitor Selection
  PDF, 219 Kb, 档案已发布: Sep 19, 2005

模型线

制造商分类

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module