Datasheet Texas Instruments MSP430F2274-EP — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430F2274-EP |
16位超低功耗微控制器，32kB闪存，1K RAM
数据表
价格
状态
| MSP430F2274MDATEP | MSP430F2274MRHATEP | V62/08631-01XE | V62/08631-01YE | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes | No | Yes | Yes |
打包
| MSP430F2274MDATEP | MSP430F2274MRHATEP | V62/08631-01XE | V62/08631-01YE | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 38 | 40 | 40 | 38 |
| Package Type | DA | RHA | RHA | DA |
| Industry STD Term | TSSOP | VQFN | VQFN | TSSOP |
| JEDEC Code | R-PDSO-G | S-PQFP-N | S-PQFP-N | R-PDSO-G |
| Package QTY | 250 | 250 | 250 | 250 |
| Carrier | SMALL T&R | SMALL T&R | SMALL T&R | SMALL T&R |
| Device Marking | M430F2274MEP | M4F2274 | M4F2274 | M430F2274MEP |
| Width (mm) | 6.2 | 6 | 6 | 6.2 |
| Length (mm) | 12.5 | 6 | 6 | 12.5 |
| Thickness (mm) | 1.15 | .9 | .9 | 1.15 |
| Pitch (mm) | .65 | .5 | .5 | .65 |
| Max Height (mm) | 1.2 | 1 | 1 | 1.2 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | MSP430F2274MDATEP | MSP430F2274MRHATEP | V62/08631-01XE | V62/08631-01YE |
|---|---|---|---|---|
| ADC | ADC10 - 12ch | ADC10 - 12ch | ADC10 - 12ch | ADC10 - 12ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 270 | 270 | 270 | 270 |
| Additional Features | Watchdog,OpAmp,Temp Sensor,Brown Out Reset | Watchdog,OpAmp,Temp Sensor,Brown Out Reset | Watchdog,OpAmp,Temp Sensor,Brown Out Reset | Watchdog,OpAmp,Temp Sensor,Brown Out Reset |
| BSL | UART | UART | UART | UART |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| Frequency, MHz | 16 | 16 | 16 | 16 |
| GPIO | 32 | 32 | 32 | 32 |
| I2C | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 32 | 32 | 32 | 32 |
| Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
| Package Group | TSSOP | VQFN | VQFN | TSSOP |
| Package Size: mm2:W x L, PKG | 38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 40VQFN: 36 mm2: 6 x 6(VQFN) | 40VQFN: 36 mm2: 6 x 6(VQFN) | 38TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) |
| RAM, KB | 1 | 1 | 1 | 1 |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 1 | 1 | 1 | 1 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.7 | 0.7 | 0.7 | 0.7 |
| Timers - 16-bit | 2 | 2 | 2 | 2 |
| UART | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1 | 1 | 1 | 1 |
生态计划
| MSP430F2274MDATEP | MSP430F2274MRHATEP | V62/08631-01XE | V62/08631-01YE | |
|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant |
应用须知
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
模型线
系列: MSP430F2274-EP (4)
制造商分类
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU