Datasheet Texas Instruments MSP430F2619S-HT — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430F2619S-HT |
高温16位超低功耗MCU，120KB闪存，4KB RAM，12位ADC，双DAC，2个USCI，硬件多重，DMA
数据表
MSP430F2619S-HT Mixed-Signal Microcontroller datasheet
PDF, 1.6 Mb, 修订版: E, 档案已发布: Nov 16, 2016
从文件中提取
价格
状态
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | No |
打包
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| N | 1 | 2 | 3 |
| Package Type | KGD | KGD | PM |
| Package QTY | 36 | 36 | 160 |
| Pin | 64 | ||
| Industry STD Term | LQFP | ||
| JEDEC Code | S-PQFP-G | ||
| Carrier | JEDEC TRAY (5+1) | ||
| Device Marking | M430F2619SPM | ||
| Width (mm) | 10 | ||
| Length (mm) | 10 | ||
| Thickness (mm) | 1.4 | ||
| Pitch (mm) | .5 | ||
| Max Height (mm) | 1.6 | ||
| Mechanical Data | 下载 |
参数化
| Parameters / Models | MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM |
|---|---|---|---|
| ADC | ADC12 - 8ch | ADC12 - 8ch | ADC12 - 8ch |
| AES | N/A | N/A | N/A |
| Active Power, uA/MHz | 365 | 365 | 365 |
| Additional Features | Watchdog,DAC,Temp Sensor,Brown Out Reset | Watchdog,DAC,Temp Sensor,Brown Out Reset | Watchdog,DAC,Temp Sensor,Brown Out Reset |
| BSL | UART | UART | UART |
| CPU | MSP430 | MSP430 | MSP430 |
| Comparators | Yes | Yes | Yes |
| DMA | 3 | 3 | 3 |
| Frequency, MHz | 16 | 16 | 16 |
| GPIO | 48 | 48 | 48 |
| I2C | 2 | 2 | 2 |
| Max VCC | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 |
| Multiplier | 16x16 | 16x16 | 16x16 |
| Non-volatile Memory, KB | 120 | 120 | 120 |
| Operating Temperature Range, C | -55 to 150 | -55 to 150 | -55 to 150 |
| Package Group | LQFP | LQFP | LQFP |
| Package Size: mm2:W x L, PKG | 64LQFP: 144 mm2: 12 x 12(LQFP) | 64LQFP: 144 mm2: 12 x 12(LQFP) | 64LQFP: 144 mm2: 12 x 12(LQFP) |
| RAM, KB | 4 | 4 | 4 |
| Rating | High Temp | High Temp | High Temp |
| SPI | 4 | 4 | 4 |
| Special I/O | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 2 | 2 | 2 |
| UART | 2 | 2 | 2 |
| Wakeup Time, us | 1 | 1 | 1 |
生态计划
| MSP430F2619S64KGD1 | MSP430F2619SKGD1 | MSP430F2619SPM | |
|---|---|---|---|
| RoHS | See ti.com | See ti.com | Compliant |
应用须知
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
模型线
系列: MSP430F2619S-HT (3)
制造商分类
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU