Datasheet Texas Instruments MSP430F5229 — 数据表

制造商	Texas Instruments
系列	MSP430F5229

数据表

价格

状态

打包

参数化

Parameters / Models	MSP430F5229IRGCR	MSP430F5229IRGCT	MSP430F5229IYFFR	MSP430F5229IYFFT	MSP430F5229IZQE	MSP430F5229IZQER
ADC	ADC10 - 10ch	ADC10 - 10ch	ADC10 - 10ch	ADC10 - 10ch	ADC10 - 10ch	ADC10 - 10ch
AES	N/A	N/A	N/A	N/A	N/A	N/A
Active Power, uA/MHz	404	404	404	404	404	404
Additional Features	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA	Real-Time Clock,Watchdog,Temp Sensor,Brown Out Reset,IrDA
BSL	UART	UART	UART	UART	UART	UART
CPU	MSP430	MSP430	MSP430	MSP430	MSP430	MSP430
Comparators	8	8	8	8	8	8
DMA	3	3	3	3	3	3
Featured	f5	f5	f5	f5	f5	f5
Frequency, MHz	25	25	25	25	25	25
GPIO Pins	53	53	53	53	53	53
I2C	2	2	2	2	2	2
Max VCC	3.6	3.6	3.6	3.6	3.6	3.6
Min VCC	1.8	1.8	1.8	1.8	1.8	1.8
Multiplier	32x32	32x32	32x32	32x32	32x32	32x32
Non-volatile Memory, KB	128	128	128	128	128	128
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	VQFN	VQFN	DSBGA	DSBGA	BGA MICROSTAR JUNIOR	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG	64VQFN: 81 mm2: 9 x 9(VQFN)	64VQFN: 81 mm2: 9 x 9(VQFN)	See datasheet (DSBGA)	See datasheet (DSBGA)	80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR)	80BGA MICROSTAR JUNIOR: 25 mm2: 5 x 5(BGA MICROSTAR JUNIOR)
RAM, KB	8	8	8	8	8	8
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
SPI	4	4	4	4	4	4
Special I/O	1.8V I/O	1.8V I/O	1.8V I/O	1.8V I/O	1.8V I/O	1.8V I/O
Standby Power, LPM3-uA	2.5	2.5	2.5	2.5	2.5	2.5
Timers - 16-bit	4	4	4	4	4	4
UART	2	2	2	2	2	2
Wakeup Time, us	3.5	3.5	3.5	3.5	3.5	3.5

生态计划

应用须知

• 下载
  MSP430 Firmware Updates over I2C using Linux
  PDF, 1.8 Mb, 档案已发布: Dec 7, 2015
• 下载
  Software I2C on MSP430 MCUs
  PDF, 126 Kb, 档案已发布: May 18, 2016
  Hardware and layout limitations often require smaller package sizes that could potentially create a tradeoff for the number of serial peripherals available to the user. With the I2C protocol, special software can be created to use a pair of simple GPIO ports to emulate an I2C master device. This allows programmers to be flexible with pin assignments and enables smaller package devices to overcome
• 下载
  Low-Power Pedometer Using an MSP430 MCU
  PDF, 182 Kb, 档案已发布: May 28, 2013
  This application report describes a low-power pedometer example application that uses an MSP430F5229 microcontroller and the TI Pedometer firmware algorithm. This application was developed and targeted for the health and fitness markets.Fitness monitors typically measure both a person's amount and rate of exercise (traveled distanced and pace) as well as effort expended (calories burned in the p
• 下载
  Enabling Low-Power Windows 8 HID Over I2C Applications Using MSP430 MCUs
  PDF, 1.4 Mb, 档案已发布: Nov 30, 2012
  The Human Interface Device (HID) protocol was originally targeted at human interface devices such as keyboards, touchpads, mice, and joysticks. It was originally developed to run over USB and Bluetooth(R). For Windows 8(R), Microsoft created a new HID miniport driver that allows devices to communicate to SoC over an Inter-Integrated Circuit (I2C) bus. Power consumption and design simplicity are ke
• 下载
  Designing with MSP430F522x and MSP430F521x Devices
  PDF, 72 Kb, 档案已发布: Nov 30, 2012
  The MSP430F522x and MSP430F521x devices support a split supply I/O system that is essential in systems in which the MCU is required to interface with external devices (such as sensors or other processors) that operate at different voltage level compared to the MCU device supply. Additionally, the split supply input voltage range of the F522x and F521x devices starts as low as 1.62 V (see the devic
• 下载
  Using the MSP430 Timer_D Module in Hi-Resolution Mode
  PDF, 870 Kb, 档案已发布: Oct 2, 2013
  This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
• 下载
  Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D)
  PDF, 151 Kb, 修订版: D, 档案已发布: Nov 3, 2016
  This application report helps enable easy migration from MSP430F5xx and MSP430F6xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight differences between the
• 下载
  General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
  PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
  Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
• 下载
  Design Considerations When Using the MSP430 Graphics Library
  PDF, 475 Kb, 档案已发布: Oct 5, 2012
  LCDs are a growing commodity in todays market with products as diverse as children's toys to medical devices. Modern LCDs, along with the graphics displayed on them, are growing in complexity. A graphics library can simplify and accelerate development while creating the desired user experience. TI provides the MSP430 Graphics Library for use in developing products with the MSP430в„ў MCU. This
• 下载
  ESD Diode Current Specification
  PDF, 520 Kb, 档案已发布: Dec 7, 2015
  This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
• 下载
  MSP Code Protection Features
  PDF, 752 Kb, 档案已发布: Dec 7, 2015
  MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur

模型线

制造商分类

• Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x