Datasheet Texas Instruments MSP430F5659 — 数据表

制造商	Texas Instruments
系列	MSP430F5659

数据表

价格

状态

打包

参数化

Parameters / Models	MSP430F5659IPZ	MSP430F5659IPZR	MSP430F5659IZQWR	MSP430F5659IZQWT
ADC	ADC12 - 12ch	ADC12 - 12ch	ADC12 - 12ch	ADC12 - 12ch
AES	N/A	N/A	N/A	N/A
Active Power, uA/MHz	370	370	370	370
Additional Features	USB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	USB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	USB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	USB,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSL	USB	USB	USB	USB
CPU	MSP430	MSP430	MSP430	MSP430
Comparators	12	12	12	12
DMA	6	6	6	6
Featured	f5	f5	f5	f5
Frequency, MHz	20	20	20	20
GPIO Pins	74	74	74	74
I2C	3	3	3	3
Max VCC	3.6	3.6	3.6	3.6
Min VCC	1.8	1.8	1.8	1.8
Multiplier	32x32	32x32	32x32	32x32
Non-volatile Memory, KB	512	512	512	512
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	LQFP	LQFP	BGA MICROSTAR JUNIOR	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG	100LQFP: 256 mm2: 16 x 16(LQFP)	100LQFP: 256 mm2: 16 x 16(LQFP)	113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)	113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB	66	66	66	66
Rating	Catalog	Catalog	Catalog	Catalog
SPI	6	6	6	6
Special I/O	N/A	N/A	N/A	N/A
Standby Power, LPM3-uA	2.6	2.6	2.6	2.6
Timers - 16-bit	4	4	4	4
UART	3	3	3	3
Wakeup Time, us	3	3	3	3

生态计划

应用须知

• 下载
  Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
  PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
  Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
• 下载
  Starting a USB Design Using MSP430 MCUs (Rev. A)
  PDF, 949 Kb, 修订版: A, 档案已发布: May 30, 2014
  This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package
• 下载
  Using the MSP430 Timer_D Module in Hi-Resolution Mode
  PDF, 870 Kb, 档案已发布: Oct 2, 2013
  This application report describes the use of the high-resolution feature of the Timer_D module introduced in MSP430F51x1 and MSP430F51x2 devices. Timer_D enables applications that require high resolution such as capacitive touch detection, PWM DACs, advanced LED lighting, and digital controllers for power supplies. This application report provides an advanced description of the use and calibration
• 下载
  General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
  PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
  Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
• 下载
  MSP Code Protection Features
  PDF, 752 Kb, 档案已发布: Dec 7, 2015
  MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
• 下载
  ESD Diode Current Specification
  PDF, 520 Kb, 档案已发布: Dec 7, 2015
  This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

模型线

制造商分类

• Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x