Datasheet Texas Instruments MSP430F6459 — 数据表

制造商	Texas Instruments
系列	MSP430F6459

数据表

价格

状态

打包

参数化

Parameters / Models	MSP430F6459IPZ	MSP430F6459IPZR	MSP430F6459IZQWR	MSP430F6459IZQWT
ADC	ADC12 - 12ch	ADC12 - 12ch	ADC12 - 12ch	ADC12 - 12ch
AES	N/A	N/A	N/A	N/A
Active Power, uA/MHz	370	370	370	370
Additional Features	LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA	LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA
BSL	UART	UART	UART	UART
CPU	MSP430	MSP430	MSP430	MSP430
Comparators	12	12	12	12
DMA	6	6	6	6
Featured	f6	f6	f6	f6
Frequency, MHz	20	20	20	20
GPIO Pins	74	74	74	74
I2C	3	3	3	3
Max VCC	3.6	3.6	3.6	3.6
Min VCC	1.8	1.8	1.8	1.8
Multiplier	32x32	32x32	32x32	32x32
Non-volatile Memory, KB	512	512	512	512
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	LQFP	LQFP	BGA MICROSTAR JUNIOR	BGA MICROSTAR JUNIOR
Package Size: mm2:W x L, PKG	100LQFP: 256 mm2: 16 x 16(LQFP)	100LQFP: 256 mm2: 16 x 16(LQFP)	113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)	113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR)
RAM, KB	66	66	66	66
Rating	Catalog	Catalog	Catalog	Catalog
SPI	6	6	6	6
Special I/O	N/A	N/A	N/A	N/A
Standby Power, LPM3-uA	2.6	2.6	2.6	2.6
Timers - 16-bit	4	4	4	4
UART	3	3	3	3
Wakeup Time, us	3	3	3	3

生态计划

应用须知

• 下载
  Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)
  PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
  Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th
• 下载
  MSP430 Embedded Application Binary Interface
  PDF, 596 Kb, 档案已发布: May 16, 2012
  This document is a specification for the ELF-based Embedded Application Binary Interface (EABI) for the MSP430 family of processors from Texas Instruments. The EABI defines the low-level interface between programs, program components, and the execution environment, including the operating system if one is present. Components of the EABI include calling conventions, data layout and addressing conve
• 下载
  Designing With MSP430 and Segment LCDs (Rev. A)
  PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
  Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented
• 下载
  General Oversampling of MSP ADCs for Higher Resolution (Rev. A)
  PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
  Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
• 下载
  MSP Code Protection Features
  PDF, 752 Kb, 档案已发布: Dec 7, 2015
  MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur
• 下载
  ESD Diode Current Specification
  PDF, 520 Kb, 档案已发布: Dec 7, 2015
  This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.

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制造商分类

• Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x