Datasheet Texas Instruments MSP430F6658 — 数据表
制造商 | Texas Instruments |
系列 | MSP430F6658 |
MSP430F66x混合信号微控制器
数据表
MSP430F665x, MSP430F645x, MSP430F565x, MSP430F535x Mixed Signal Microcontroller datasheet
PDF, 1.9 Mb, 修订版: C, 档案已发布: Oct 21, 2013
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价格
状态
MSP430F6658IPZ | MSP430F6658IPZR | MSP430F6658IZQWR | |
---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | No |
打包
MSP430F6658IPZ | MSP430F6658IPZR | MSP430F6658IZQWR | |
---|---|---|---|
N | 1 | 2 | 3 |
Pin | 100 | 100 | 113 |
Package Type | PZ | PZ | ZQW |
Industry STD Term | LQFP | LQFP | BGA MICROSTAR JUNIOR |
JEDEC Code | S-PQFP-G | S-PQFP-G | S-PBGA-N |
Package QTY | 90 | 1000 | 2500 |
Carrier | JEDEC TRAY (10+1) | LARGE T&R | LARGE T&R |
Device Marking | F6658 | F6658 | F6658 |
Width (mm) | 14 | 14 | 7 |
Length (mm) | 14 | 14 | 7 |
Thickness (mm) | 1.4 | 1.4 | .74 |
Pitch (mm) | .5 | .5 | .5 |
Max Height (mm) | 1.6 | 1.6 | 1 |
Mechanical Data | 下载 | 下载 | 下载 |
参数化
Parameters / Models | MSP430F6658IPZ | MSP430F6658IPZR | MSP430F6658IZQWR |
---|---|---|---|
ADC | ADC12 - 12ch | ADC12 - 12ch | ADC12 - 12ch |
AES | N/A | N/A | N/A |
Active Power, uA/MHz | 370 | 370 | 370 |
Additional Features | USB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA | USB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA | USB,LCD,Real-Time Clock,Watchdog,DAC,Temp Sensor,Brown Out Reset,IrDA |
BSL | USB | USB | USB |
CPU | MSP430 | MSP430 | MSP430 |
Comparators | 12 | 12 | 12 |
DMA | 6 | 6 | 6 |
Featured | f6 | f6 | f6 |
Frequency, MHz | 20 | 20 | 20 |
GPIO Pins | 74 | 74 | 74 |
I2C | 3 | 3 | 3 |
Max VCC | 3.6 | 3.6 | 3.6 |
Min VCC | 1.8 | 1.8 | 1.8 |
Multiplier | 32x32 | 32x32 | 32x32 |
Non-volatile Memory, KB | 384 | 384 | 384 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 |
Package Group | LQFP | LQFP | BGA MICROSTAR JUNIOR |
Package Size: mm2:W x L, PKG | 100LQFP: 256 mm2: 16 x 16(LQFP) | 100LQFP: 256 mm2: 16 x 16(LQFP) | 113BGA MICROSTAR JUNIOR: 49 mm2: 7 x 7(BGA MICROSTAR JUNIOR) |
RAM, KB | 34 | 34 | 34 |
Rating | Catalog | Catalog | Catalog |
SPI | 6 | 6 | 6 |
Special I/O | N/A | N/A | N/A |
Standby Power, LPM3-uA | 2.6 | 2.6 | 2.6 |
Timers - 16-bit | 4 | 4 | 4 |
UART | 3 | 3 | 3 |
Wakeup Time, us | 3 | 3 | 3 |
生态计划
MSP430F6658IPZ | MSP430F6658IPZR | MSP430F6658IZQWR | |
---|---|---|---|
RoHS | Compliant | Compliant | Compliant |
应用须知
- Using the MSP430 RTC_B Module With Battery Backup Supply (Rev. B)PDF, 135 Kb, 修订版: B, 档案已发布: Jun 4, 2015
Some applications need to retain an accurate real-time clock (RTC) through battery changes, power outages, and other events. For these applications, MSP430в„ў devices that contain the RTC_B Real-Time Clock module with a Battery Backup System can be a great fit. This application note demonstrates how to use RTC_B with Battery Backup Supply functionality to retain the time and keep the RTC counting th - Starting a USB Design Using MSP430 MCUs (Rev. A)PDF, 949 Kb, 修订版: A, 档案已发布: May 30, 2014
This document is a high-level starting point for those wanting to design USB devices with MSP430в„ў MCUs. It provides an overview of the TI MSP430 hardware and software offerings for USB, as well as guidance in quickly getting started.Among the topics covered:An overview of the MSP430 hardware USB moduleAn introduction to the MSP430 USB Developer's Package - Designing With MSP430 and Segment LCDs (Rev. A)PDF, 2.1 Mb, 修订版: A, 档案已发布: Jul 20, 2015
Segment liquid crystal displays (LCDs) are needed to provide information to users in a wide variety of applications from smart meters to electronic shelf labels (ESL) to medical equipment. Several MSP430в„ў microcontroller families include built-in low-power LCD driver circuitry that allows the MSP430 MCU to directly control the segmented LCD glass. This application note helps explain how segmented - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, 修订版: A, 档案已发布: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl - MSP Code Protection FeaturesPDF, 752 Kb, 档案已发布: Dec 7, 2015
MSP microcontrollers (MCUs) offer a number of features to help control code accessibility in the device, to add different layers of code access management and protection strategies. These include features that can lock or password protect the JTAG/SBW access, IP Encapsulation (IPE) to isolate sensitive code with different permissions than the rest of the program, and bootloader (BSL) access featur - ESD Diode Current SpecificationPDF, 520 Kb, 档案已发布: Dec 7, 2015
This document explains the maximum ESD diode current specified for GPIO on MSP microcontrollers. Sometimes signals on specific pins exceed the supply of the MSP MCU. In such a case, the device can handle this overvoltage condition through the ESD diodes, but the ESD diode specification must be considered during application design. The items to be considered are described in this document.
模型线
系列: MSP430F6658 (3)
制造商分类
- Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430F5x/6x