Datasheet Texas Instruments MSP430G2230-EP — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430G2230-EP |
增强型产品16位超低功耗混合信号微控制器，2kB闪存，128B RAM
数据表
价格
状态
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | Yes | No | Yes |
打包
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 8 | 8 | 8 | 8 |
| Package Type | D | D | D | D |
| Industry STD Term | SOIC | SOIC | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
| Package QTY | 75 | 2500 | 2500 | 75 |
| Carrier | TUBE | LARGE T&R | LARGE T&R | TUBE |
| Device Marking | G230EP | G230EP | G230EP | G230EP |
| Width (mm) | 3.91 | 3.91 | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 | 1.75 | 1.75 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T |
|---|---|---|---|---|
| ADC | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch | ADC10 - 4ch |
| AES | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 220 | 220 | 220 | 220 |
| Additional Features | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset | Watchdog,Temp Sensor,Brown Out Reset |
| BSL | I2C | I2C | I2C | I2C |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 |
| DMA | 1 | 1 | 1 | 1 |
| Frequency, MHz | 16 | 16 | 16 | 16 |
| GPIO | 4 | 4 | 4 | 4 |
| I2C | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 2 | 2 | 2 | 2 |
| Operating Temperature Range, C | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 |
| Package Group | SOIC | SOIC | SOIC | SOIC |
| Package Size: mm2:W x L, PKG | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) | 8SOIC: 29 mm2: 6 x 4.9(SOIC) |
| RAM, KB | 0.125 | 0.125 | 0.125 | 0.125 |
| Rating | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product | HiRel Enhanced Product |
| SPI | 1 | 1 | 1 | 1 |
| Special I/O | N/A | N/A | N/A | N/A |
| Standby Power, LPM3-uA | 0.5 | 0.5 | 0.5 | 0.5 |
| Timers - 16-bit | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1 | 1 | 1 | 1 |
生态计划
| MSP430G2230QDEP | MSP430G2230QDREP | V62/12620-01XE | V62/12620-01XE-T | |
|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant |
应用须知
- Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430
模型线
系列: MSP430G2230-EP (4)
制造商分类
- Semiconductors> Space & High Reliability> Microcontroller> Low Power MCU> MSP430 MCU