Datasheet Texas Instruments MSP430G2233 — 数据表
| 制造商 | Texas Instruments |
| 系列 | MSP430G2233 |
MSP430G2x33，MSP430G2x03混合信号微控制器
数据表
MSP430G2x33, MSP430G2x03 Mixed-Signal Microcontrollers datasheet
PDF, 1.8 Mb, 修订版: G, 档案已发布: Apr 27, 2016
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价格
状态
| MSP430G2233IN20 | MSP430G2233IPW20 | MSP430G2233IPW20R | MSP430G2233IPW28 | MSP430G2233IPW28R | MSP430G2233IRHB32R | MSP430G2233IRHB32T | |
|---|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | Yes | No | No | No | No |
打包
| MSP430G2233IN20 | MSP430G2233IPW20 | MSP430G2233IPW20R | MSP430G2233IPW28 | MSP430G2233IPW28R | MSP430G2233IRHB32R | MSP430G2233IRHB32T | |
|---|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
| Pin | 20 | 20 | 20 | 28 | 28 | 32 | 32 |
| Package Type | N | PW | PW | PW | PW | RHB | RHB |
| Industry STD Term | PDIP | TSSOP | TSSOP | TSSOP | TSSOP | VQFN | VQFN |
| JEDEC Code | R-PDIP-T | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | S-PQFP-N | S-PQFP-N |
| Package QTY | 20 | 70 | 2000 | 50 | 2000 | 3000 | 250 |
| Device Marking | M430G2233 | 430G2233 | 430G2233 | 430G2233 | 430G2233 | MSP430 | G2233 |
| Width (mm) | 6.35 | 4.4 | 4.4 | 4.4 | 4.4 | 5 | 5 |
| Length (mm) | 24.33 | 6.5 | 6.5 | 9.7 | 9.7 | 5 | 5 |
| Thickness (mm) | 4.57 | 1 | 1 | 1 | 1 | .9 | .9 |
| Pitch (mm) | 2.54 | .65 | .65 | .65 | .65 | .5 | .5 |
| Max Height (mm) | 5.08 | 1.2 | 1.2 | 1.2 | 1.2 | 1 | 1 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 |
| Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R | LARGE T&R | SMALL T&R |
参数化
| Parameters / Models | MSP430G2233IN20 | MSP430G2233IPW20 | MSP430G2233IPW20R | MSP430G2233IPW28 | MSP430G2233IPW28R | MSP430G2233IRHB32R | MSP430G2233IRHB32T |
|---|---|---|---|---|---|---|---|
| ADC | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch | ADC10 - 8ch |
| AES | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Active Power, uA/MHz | 330 | 330 | 330 | 330 | 330 | 330 | 330 |
| Additional Features | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA | Watchdog,Temp Sensor,Brown Out Reset,IrDA |
| BSL | UART | UART | UART | UART | UART | UART | UART |
| CPU | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 |
| Featured | g2 | g2 | g2 | g2 | g2 | g2 | g2 |
| Frequency, MHz | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| GPIO Pins | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| I2C | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Max VCC | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
| Min VCC | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 |
| Multiplier | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Non-volatile Memory, KB | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
| Package Group | PDIP | TSSOP | TSSOP | TSSOP | TSSOP | VQFN | VQFN |
| Package Size: mm2:W x L, PKG | See datasheet (PDIP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 32VQFN: 25 mm2: 5 x 5(VQFN) | 32VQFN: 25 mm2: 5 x 5(VQFN) |
| RAM, KB | 0.25 | 0.25 | 0.25 | 0.25 | 0.25 | 0.25 | 0.25 |
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
| SPI | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Special I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O | Capacitive Touch I/O |
| Standby Power, LPM3-uA | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 |
| Timers - 16-bit | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| UART | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Wakeup Time, us | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 | 1.5 |
生态计划
| MSP430G2233IN20 | MSP430G2233IPW20 | MSP430G2233IPW20R | MSP430G2233IPW28 | MSP430G2233IPW28R | MSP430G2233IRHB32R | MSP430G2233IRHB32T | |
|---|---|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
| Pb Free | Yes |
应用须知
- Capacitive Touch Sensing, MSP430 Button Gate Time Optimization and Tuning GuidePDF, 1.1 Mb, 档案已发布: May 21, 2013
MSP430в„ў microcontroller based capacitive touch buttons can offer increased performance when properly optimized and tuned for their specific application. Performance benefits that result from button optimization can include, but are not limited to, decreased power consumption, improved response time, and the ability to grow a design to include more buttons. This application report provides th - Capacitive Touch Sensing, MSP430 Slider and Wheel Tuning GuidePDF, 1.0 Mb, 档案已发布: May 21, 2013
This application report provides guidelines on how to tune capacitive touch sliders and wheels running on the MSP430в„ў microcontrollers. It identifies the hardware and software parameters as well as explains the steps used in tuning sliders and wheels.The slider and wheel tuning is based on the APIs defined within the Capacitive Touch Sense Library (CAPSENSELIBRARY). - Capacitive Touch Hardware Design Guide (Rev. A)PDF, 784 Kb, 修订版: A, 档案已发布: Nov 17, 2015
Capacitive touch detection is sometimes considered more art than science. This often results in multiple design iterations before the optimum performance is achieved. There are, however, good design practices for circuit layout and principles of materials that need to be understood to keep the number of iterations to a minimum. This design guide describes a process for creating and designing capac - 1-uA Capacitive Grip Detection Based on MSP430 Microcontrollers (Rev. B)PDF, 373 Kb, 修订版: B, 档案已发布: Aug 14, 2013
This application report discusses how to design a simple and ultra low-power grip detector BoosterPack for the MSP430 LaunchPadв„ў. The PINOSC feature in every msp430G2xx2 and msp430G2xx3 device makes it possible to eliminate all the external components when implementing a capacitive touch design. All the components used in the grip detector, such as capacitive sensors, LEDs are all integrate - Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, 修订版: E, 档案已发布: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)PDF, 179 Kb, 修订版: E, 档案已发布: Nov 3, 2016
This application report enables easy migration from MSP430F2xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx family of FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two f
模型线
系列: MSP430G2233 (7)
制造商分类
- Semiconductors> Microcontrollers (MCU)> MSP430 ultra-low-power MCUs> MSP430G2x/i2x