Datasheet Texas Instruments OMAP3515DCBBA — 数据表

制造商	Texas Instruments
系列	OMAP3515
零件号	OMAP3515DCBBA

数据表

价格

状态

打包

参数化

生态计划

设计套件和评估模块

• Evaluation Modules & Boards: TMDSEVM3530
  OMAP35x Evaluation Module (EVM)
  Lifecycle Status: Active (Recommended for new designs)
  
  • 下载
• JTAG Emulators/ Analyzers: TMDSEMU200-U
  XDS200 USB Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
  XDS560v2 System Trace USB & Ethernet Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  
• JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
  XDS560v2 System Trace USB Debug Probe
  Lifecycle Status: Active (Recommended for new designs)
  

应用须知

• 下载
  Powering OMAP3 With TPS6235x: Design-In Guide
  PDF, 296 Kb, 档案已发布: Dec 3, 2008
  The OMAP35xx Applications Processors have a diverse set of power management features which potentially enable lower cost power solutions based on your application. This design-in guide describes a power solution based on the TPS6235x device. This guide can be used to evaluate this solution for your design or help you make decisions when designing in this solution.
• 下载
  OMAP35x Linux PSP Data Sheet
  PDF, 1.6 Mb, 档案已发布: Oct 16, 2009
• 下载
  OMAP35x 0.65mm Pitch Layout Methods (Rev. B)
  PDF, 372 Kb, 修订版: B, 档案已发布: Jun 26, 2008
  It is easy to see from the unique look that the OMAP35x parts have a very unusual footprint. The OMAP35x ball grid array is designed with new technology called the Via Channel array which makes significant printed circuit board (PCB) cost savings possible. If the PCB is routed correctly this cost savings can be substantial. This application report explains how this is possible and shows several
• 下载
  OMAP3530/25/15/03 CBB CBC & CUS Reflow Profiles
  PDF, 27 Kb, 档案已发布: Nov 13, 2009
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://wiki.davincidsp.com/index.php/OMAP3_CBB_CBC_CUS_Reflow_Profiles

  Reflow profiles are dependent on numerous factors including package type number of components bo

• 下载
  Powering OMAP3 With TPS65023: Design-In Guide (Rev. B)
  PDF, 181 Kb, 修订版: B, 档案已发布: Mar 2, 2009
• 下载
  OMAP35x to AM35x Hardware Migration Guide
  PDF, 19 Kb, 档案已发布: May 24, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_to_AM35x_Hardware_Migration_Guide.

  This article describes hardware device considerations to migrate a design

• 下载
  OMAP35x to AM37x Hardware Migration Guide
  PDF, 37 Kb, 档案已发布: Jun 3, 2010
  This article has been contributed to the TI Developer Wiki. To see the most recently updated version or to contribute visit this topic at:

  http://processors.wiki.ti.com/index.php/OMAP35x_To_AM37x_Hardware_Migration_Guide.

  The OMAP35x to AM37x Hardware Migration Guide describes device consideratio

• 下载
  PCB Assembly Guidelines for 0.4mm Package-On-Package (PoP) Packages Part II (Rev. A)
  PDF, 2.4 Mb, 修订版: A, 档案已发布: Nov 1, 2013
  Once the bottom circuit board has been designed the assembly guidelines for package-on-package (PoP) versions of the OMAP35xx processor and the memory device must be considered.

  PoP packages have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of final assembly: the circuit board design the solder paste char

• 下载
  PCB Design Guidelines for 0.4mm Package-On-Package (PoP) Packages Part I (Rev. B)
  PDF, 6.7 Mb, 修订版: B, 档案已发布: Jun 13, 2009
  Ball grid array (BGA) packages having 0.4mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies; the standard rules of thumb don't apply anymore. In fact the design guidelines for 0.4mm and 0.5mm differ primarily due to issues surrounding shorts or opens between balls under the processor.In addition to the de
• 下载
  PCB Design Guidelines for 0.5mm Package-On-Package Apps Processors Part I
  PDF, 2.0 Mb, 档案已发布: Jun 23, 2010
  Ball grid array (BGA) packages having 0.5mm ball pitch require careful attention to printed circuit board (PCB) design parameters to successfully yield reliable and robust assemblies. PCBs with package-on-package (PoP) technology have additional assembly requirements and options that need to be considered when designing the PCB.

  Fine-pitch PCB design is a team effort and may require more than

• 下载
  PCB Assembly Guidelines for 0.5mm Package-on-Package Apps Processors Part II
  PDF, 1.2 Mb, 档案已发布: Jun 23, 2010
  Once the main printed circuit board (PCB) has been designed the assembly guidelines for the 0.5mm package-on-package (PoP) applications processor and companion memory device must be considered. PoP applications processors have an enormous number of variables associated with assembly. The following factors have a major effect on the quality and reliability of PCB assembly: PoP applications process

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制造商分类

• Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM3x