Datasheet Texas Instruments OMAPL138B-EP — 数据表

制造商Texas Instruments
系列OMAPL138B-EP
Datasheet Texas Instruments OMAPL138B-EP

增强型产品低功耗应用处理器

数据表

OMAPL138B-EP C6000 DSP+ARMВ® Processor datasheet
PDF, 1.8 Mb, 修订版: C, 档案已发布: Apr 12, 2013
从文件中提取

价格

状态

OMAPL138BGWTMEPV62/12605-01XE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesNo

打包

OMAPL138BGWTMEPV62/12605-01XE
N12
Pin361361
Package TypeGWTGWT
Industry STD TermNFBGANFBGA
JEDEC CodeS-PBGA-NS-PBGA-N
Package QTY9090
CarrierJEDEC TRAY (5+1)JEDEC TRAY (5+1)
Device MarkingGWTMEPGWTMEP
Width (mm)1616
Length (mm)1616
Thickness (mm).9.9
Pitch (mm).8.8
Max Height (mm)1.41.4
Mechanical Data下载下载

参数化

Parameters / ModelsOMAPL138BGWTMEP
OMAPL138BGWTMEP
V62/12605-01XE
V62/12605-01XE
ARM CPU1 ARM91 ARM9
ARM MHz, Max.345345
ApplicationsCommunications and Telecom,Energy,Industrial,MedicalCommunications and Telecom,Energy,Industrial,Medical
DRAMLPDDR,DDR2LPDDR,DDR2
DSP1 C674x1 C674x
DSP MHz, Max.345345
Display Options11
EMAC10/10010/100
I2C22
On-Chip L2 Cache256 KB (DSP)256 KB (DSP)
Operating SystemsLinux,SYS/BIOSLinux,SYS/BIOS
Operating Temperature Range, C-55 to 125-55 to 125
Other On-Chip Memory128 KB128 KB
RatingHiRel Enhanced ProductHiRel Enhanced Product
SPI22
UART, SCI33
USB22
Video Port, Configurable11

生态计划

OMAPL138BGWTMEPV62/12605-01XE
RoHSSee ti.comSee ti.com

应用须知

  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, 修订版: B, 档案已发布: Aug 13, 2015
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, 修订版: B, 档案已发布: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, 修订版: A, 档案已发布: Aug 9, 2015

模型线

系列: OMAPL138B-EP (2)

制造商分类

  • Semiconductors> Space & High Reliability> Processor> Digital Signal Processor> C6000 DSP + ARM Processor