Datasheet Texas Instruments PT3301C — 数据表
制造商 | Texas Instruments |
系列 | PT3301 |
零件号 | PT3301C |
数据表
价格
状态
Lifecycle Status | NRND (Not recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 19 |
Package Type | EHJ |
Industry STD Term | SIP MODULE |
JEDEC Code | R-MSIP-G |
Width (mm) | 32.5 |
Length (mm) | 71.37 |
Thickness (mm) | 12.45 |
Pitch (mm) | 2.54 |
Max Height (mm) | 12.95 |
Mechanical Data | 下载 |
生态计划
RoHS | Not Compliant |
Pb Free | No |
应用须知
- Reflow Soldering Requirements for Plug-In Power Suface-Mount ProductsPDF, 44 Kb, 档案已发布: Aug 1, 2000
Describes the soldering requirements for the surface mount versions of all Plug-in Power products, and gives guidelines for the development of a suitable reflow profile. - ISR Input/Output Filters (Rev. A)PDF, 81 Kb, 修订版: A, 档案已发布: Aug 3, 2000
- EMI Considerations for DC to DC Converters and Integrated Switching Regulators (Rev. A)PDF, 38 Kb, 修订版: A, 档案已发布: Aug 3, 2000
- ISR Qualification Process (Rev. A)PDF, 50 Kb, 修订版: A, 档案已发布: Aug 3, 2000
模型线
制造商分类
- Semiconductors > Power Management > Power Modules > Non-Isolated Module > Step-Down (Buck) Module