Datasheet Texas Instruments SN54166 — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN54166 |
并行加载8位移位寄存器
数据表
价格
状态
| 5962-9558301QEA | 5962-9558301QFA | SN54166J | SNJ54166J | SNJ54166W | |
|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | No | No | No |
打包
| 5962-9558301QEA | 5962-9558301QFA | SN54166J | SNJ54166J | SNJ54166W | |
|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 |
| Pin | 16 | 16 | 16 | 16 | 16 |
| Package Type | J | W | J | J | W |
| Industry STD Term | CDIP | CFP | CDIP | CDIP | CFP |
| JEDEC Code | R-GDIP-T | R-GDFP-F | R-GDIP-T | R-GDIP-T | R-GDFP-F |
| Package QTY | 1 | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE | TUBE |
| Device Marking | A | SNJ54166W | SN54166J | 5962-9558301QE | SNJ54166W |
| Width (mm) | 6.92 | 6.73 | 6.92 | 6.92 | 6.73 |
| Length (mm) | 19.56 | 10.3 | 19.56 | 19.56 | 10.3 |
| Thickness (mm) | 4.57 | 1.65 | 4.57 | 4.57 | 1.65 |
| Pitch (mm) | 2.54 | 1.27 | 2.54 | 2.54 | 1.27 |
| Max Height (mm) | 5.08 | 2.03 | 5.08 | 5.08 | 2.03 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 |
生态计划
| 5962-9558301QEA | 5962-9558301QFA | SN54166J | SNJ54166J | SNJ54166W | |
|---|---|---|---|---|---|
| RoHS | See ti.com | See ti.com | See ti.com | See ti.com | See ti.com |
应用须知
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, 档案已发布: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Power-Up Behavior of Clocked Devices (Rev. A)PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015
- Live InsertionPDF, 150 Kb, 档案已发布: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, 档案已发布: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Kb, 档案已发布: Apr 30, 2015
模型线
系列: SN54166 (5)
制造商分类
- Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers