Datasheet Texas Instruments SN54ACT14 — 数据表

制造商Texas Instruments
系列SN54ACT14
Datasheet Texas Instruments SN54ACT14

六角施密特触发器逆变器

数据表

SN54ACT14, SN74ACT14 datasheet
PDF, 1.2 Mb, 修订版: H, 档案已发布: Nov 9, 2004
从文件中提取

价格

状态

5962-9218301M2A5962-9218301MCA5962-9218301MDASNJ54ACT14FKSNJ54ACT14JSNJ54ACT14W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNo

打包

5962-9218301M2A5962-9218301MCA5962-9218301MDASNJ54ACT14FKSNJ54ACT14JSNJ54ACT14W
N123456
Pin201414201414
Package TypeFKJWFKJW
Industry STD TermLCCCCDIPCFPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY111111
CarrierTUBETUBETUBETUBETUBETUBE
Width (mm)8.896.675.978.896.675.97
Length (mm)8.8919.569.218.8919.569.21
Thickness (mm)1.834.571.591.834.571.59
Pitch (mm)1.272.541.271.272.541.27
Max Height (mm)2.035.082.032.035.082.03
Mechanical Data下载下载下载下载下载下载
Device MarkingSNJ54ACTAA

参数化

Parameters / Models5962-9218301M2A
5962-9218301M2A
5962-9218301MCA
5962-9218301MCA
5962-9218301MDA
5962-9218301MDA
SNJ54ACT14FK
SNJ54ACT14FK
SNJ54ACT14J
SNJ54ACT14J
SNJ54ACT14W
SNJ54ACT14W
Bits666666
Input TypeTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output TypeCMOSCMOSCMOSCMOSCMOSCMOS
Package GroupLCCCCDIPCFPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Schmitt TriggerYesYesYesYesYesYes
Technology FamilyACTACTACTACTACTACT
VCC(Max), V5.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.5
Voltage(Nom), V555555

生态计划

5962-9218301M2A5962-9218301MCA5962-9218301MDASNJ54ACT14FKSNJ54ACT14JSNJ54ACT14W
RoHSSee ti.comSee ti.comSee ti.comSee ti.comSee ti.comSee ti.com

应用须知

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    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Buffer Drivers