Datasheet Texas Instruments SN54ACT8990 — 数据表

制造商Texas Instruments
系列SN54ACT8990
Datasheet Texas Instruments SN54ACT8990

测试总线控制器

数据表

Test Bus Controllers, JTAG TAP Masters With 16-Bit Generic Host Interfaces datasheet
PDF, 923 Kb, 修订版: E, 档案已发布: Jan 1, 1997
从文件中提取

价格

状态

5962-9322801MXA5962-9322801MYASNJ54ACT8990GBSNJ54ACT8990HV
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

打包

5962-9322801MXA5962-9322801MYASNJ54ACT8990GBSNJ54ACT8990HV
N1234
Pin68686868
Package TypeHVGBGBHV
Industry STD TermCFPCPGACPGACFP
JEDEC CodeS-GQFP-FS-CPGA-PS-CPGA-PS-GQFP-F
Package QTY1111
CarrierTUBEJEDEC TRAY (5+1)JEDEC TRAY (5+1)TUBE
Device Marking5962-9322801MXSNJ54ACT8990GBSNJ54ACT8990GB5962-9322801MX
Width (mm)12.5124.3824.3812.51
Length (mm)12.5124.3824.3812.51
Thickness (mm)3.562.032.033.56
Pitch (mm).6352.542.54.635
Max Height (mm)3.863.623.623.86
Mechanical Data下载下载下载下载

参数化

Parameters / Models5962-9322801MXA
5962-9322801MXA
5962-9322801MYA
5962-9322801MYA
SNJ54ACT8990GB
SNJ54ACT8990GB
SNJ54ACT8990HV
SNJ54ACT8990HV
Input TypeTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125
Output TypeCMOSCMOSCMOSCMOS
Package GroupCFPCPGACPGACFP
Package Size: mm2:W x L, PKGSee datasheet (CFP)See datasheet (CPGA)See datasheet (CPGA)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitary
Technology FamilyACTACTACTACT
VCC(Max), V5.55.55.55.5
VCC(Min), V4.54.54.54.5

生态计划

5962-9322801MXA5962-9322801MYASNJ54ACT8990GBSNJ54ACT8990HV
RoHSSee ti.comSee ti.comSee ti.comSee ti.com

应用须知

  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, 档案已发布: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, 档案已发布: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Selecting the Right Level Translation Solution (Rev. A)
    PDF, 313 Kb, 修订版: A, 档案已发布: Jun 22, 2004
    Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, 档案已发布: Apr 30, 2015
  • Implications of Slow or Floating CMOS Inputs (Rev. D)
    PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
  • Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
    PDF, 43 Kb, 档案已发布: Apr 1, 1996
    Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

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  • Semiconductors> Space & High Reliability> Logic Products> Specialty Logic Products> Boundary Scan (JTAG)