Datasheet Texas Instruments SN54ALS29821 — 数据表

制造商	Texas Instruments
系列	SN54ALS29821

数据表

价格

状态

打包

参数化

Parameters / Models	5962-9061601LA	SNJ54ALS29821JT
3-State Output	Yes	Yes
Bits	10	10
F @ Nom Voltage(Max), Mhz	75	75
ICC @ Nom Voltage(Max), mA	15	15
Input Type	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	48/-24	48/-24
Output Type	TTL	TTL
Package Group	CDIP	CDIP
Package Size: mm2:W x L, PKG	See datasheet (CDIP)	See datasheet (CDIP)
Rating	Military	Military
Technology Family	ALS	ALS
VCC(Max), V	5.25	5.25
VCC(Min), V	4.75	4.75
tpd @ Nom Voltage(Max), ns	10	10

生态计划

应用须知

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  PDF, 1.7 Mb, 档案已发布: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  Advanced Schottky (ALS and AS) Logic Families
  PDF, 1.9 Mb, 档案已发布: Aug 1, 1995
  This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
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  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
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  PDF, 337 Kb, 档案已发布: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Designing With Logic (Rev. C)
  PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Kb, 档案已发布: Apr 30, 2015

模型线

制造商分类

• Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers