Datasheet Texas Instruments SN54BCT543 — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN54BCT543 |
具有三态输出的八路寄存器收发器
数据表
Octal Registered Transceivers With 3-State Outputs datasheet
PDF, 254 Kb, 修订版: C, 档案已发布: Apr 1, 1994
从文件中提取
价格
状态
| 5962-9087001M3A | 5962-9087001MKA | 5962-9087001MLA | SNJ54BCT543FK | SNJ54BCT543JT | SNJ54BCT543W | |
|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Lifebuy (Manufacturer has announced that the device will be discontinued, and a lifetime-buy period is in effect) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | No | No | No | No |
打包
| 5962-9087001M3A | 5962-9087001MKA | 5962-9087001MLA | SNJ54BCT543FK | SNJ54BCT543JT | SNJ54BCT543W | |
|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 |
| Pin | 28 | 24 | 24 | 28 | 24 | 24 |
| Package Type | FK | W | JT | FK | JT | W |
| Industry STD Term | LCCC | CFP | CDIP | LCCC | CDIP | CFP |
| JEDEC Code | S-CQCC-N | R-GDFP-F | R-GDIP-T | S-CQCC-N | R-GDIP-T | R-GDFP-F |
| Package QTY | 1 | 1 | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE | TUBE | TUBE |
| Width (mm) | 11.43 | 9.09 | 6.92 | 11.43 | 6.92 | 9.09 |
| Length (mm) | 11.43 | 14.36 | 32 | 11.43 | 32 | 14.36 |
| Thickness (mm) | 1.83 | 1.72 | 4.7 | 1.83 | 4.7 | 1.72 |
| Pitch (mm) | 1.27 | 1.27 | 2.54 | 1.27 | 2.54 | 1.27 |
| Max Height (mm) | 2.03 | 2.29 | 5.08 | 2.03 | 5.08 | 2.29 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 |
| Device Marking | 5962- | SNJ54BCT543JT | A |
参数化
| Parameters / Models | 5962-9087001M3A | 5962-9087001MKA | 5962-9087001MLA | SNJ54BCT543FK | SNJ54BCT543JT | SNJ54BCT543W |
|---|---|---|---|---|---|---|
| Bits | 8 | 8 | 8 | 8 | 8 | 8 |
| Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
| Package Group | LCCC | CDIP,LCCC | CDIP | LCCC | CDIP | CFP |
| Package Size: mm2:W x L, PKG | 28LCCC: 131 mm2: 11.43 x 11.43(LCCC) | See datasheet (CDIP),28LCCC: 131 mm2: 11.43 x 11.43(LCCC) | See datasheet (CDIP) | 28LCCC: 131 mm2: 11.43 x 11.43(LCCC) | See datasheet (CDIP) | See datasheet (CFP) |
| Rating | Military | Military | Military | Military | Military | Military |
| Schmitt Trigger | No | No | No | No | No | No |
| Technology Family | BCT | BCT | BCT | BCT | BCT | BCT |
| VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
| VCC(Min), V | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
生态计划
| 5962-9087001M3A | 5962-9087001MKA | 5962-9087001MLA | SNJ54BCT543FK | SNJ54BCT543JT | SNJ54BCT543W | |
|---|---|---|---|---|---|---|
| RoHS | See ti.com | See ti.com | See ti.com | See ti.com | See ti.com | See ti.com |
应用须知
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, 档案已发布: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, 档案已发布: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Live InsertionPDF, 150 Kb, 档案已发布: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, 档案已发布: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Kb, 档案已发布: Apr 30, 2015
- Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016
模型线
系列: SN54BCT543 (6)
制造商分类
- Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers