Datasheet Texas Instruments SN54F20 — 数据表

制造商	Texas Instruments
系列	SN54F20

数据表

价格

状态

打包

参数化

Parameters / Models	5962-9758401Q2A	5962-9758401QCA	5962-9758401QDA	JM38510/33004B2A	JM38510/33004BCA	JM38510/33004BDA	M38510/33004B2A	M38510/33004BCA	M38510/33004BDA	SN54F20J	SNJ54F20FK	SNJ54F20J	SNJ54F20W
Bits	2	2	2	2	2	2	2	2	2	2	2	2	2
F @ Nom Voltage(Max), Mhz	70	70	70	70	70	70	70	70	70	70	70	70	70
ICC @ Nom Voltage(Max), mA	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051	0.0051
Input Type	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Operating Temperature Range, C	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20	1/-20
Output Type	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL	TTL
Package Group	LCCC	CDIP	CFP	LCCC	CDIP	CFP	LCCC	CDIP	CFP	CDIP	LCCC	CDIP	CFP
Package Size: mm2:W x L, PKG	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)	See datasheet (CDIP)	20LCCC: 79 mm2: 8.89 x 8.89(LCCC)	See datasheet (CDIP)	See datasheet (CFP)
Rating	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military	Military
Schmitt Trigger	No	No	No	No	No	No	No	No	No	No	No	No	No
Technology Family	F	F	F	F	F	F	F	F	F	F	F	F	F
VCC(Max), V	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VCC(Min), V	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5
tpd @ Nom Voltage(Max), ns	6	6	6	6	6	6	6	6	6	6	6	6	6

生态计划

应用须知

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  The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
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  TI IBIS File Creation Validation and Distribution Processes
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• 下载
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  PDF, 337 Kb, 档案已发布: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• 下载
  Designing With Logic (Rev. C)
  PDF, 186 Kb, 修订版: C, 档案已发布: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Introduction to Logic
  PDF, 93 Kb, 档案已发布: Apr 30, 2015

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制造商分类

• Semiconductors> Space & High Reliability> Logic Products> Gate Products