Datasheet Texas Instruments SN54GTL16612 — 数据表

制造商	Texas Instruments
系列	SN54GTL16612

数据表

价格

状态

打包

参数化

Parameters / Models	5962-9689001QXA	SNJ54GTL16612WD
Bits	18	18
F @ Nom Voltage(Max), Mhz	95	95
ICC @ Nom Voltage(Max), mA	120	120
Input Type	GTL/GTL+/LVTTL	GTL/GTL+/LVTTL
Operating Temperature Range, C	-55 to 125	-55 to 125
Output Drive (IOL/IOH)(Max), mA	64	64
Output Type	GTL/GTL+/LVTTL	GTL/GTL+/LVTTL
Package Group	CFP	CFP
Package Size: mm2:W x L, PKG	See datasheet (CFP)	See datasheet (CFP)
Rating	Military	Military
Schmitt Trigger	No	No
Technology Family	GTL	GTL
VCC(Max), V	5.25	5.25
VCC(Min), V	3.15	3.15
tpd @ Nom Voltage(Max), ns	6.3	6.3

生态计划

应用须知

• 下载
  GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
  PDF, 184 Kb, 修订版: A, 档案已发布: Mar 1, 1997
  GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
• 下载
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, 档案已发布: May 1, 1996
• 下载
  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, 档案已发布: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
• 下载
  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Kb, 档案已发布: May 10, 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
• 下载
  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, 修订版: C, 档案已发布: Dec 2, 2015
• 下载
  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, 档案已发布: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
• 下载
  Introduction to Logic
  PDF, 93 Kb, 档案已发布: Apr 30, 2015
• 下载
  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Kb, 修订版: D, 档案已发布: Jun 23, 2016

模型线

制造商分类

• Semiconductors> Space & High Reliability> Logic Products> Backplane Logic (GTL/TTL/BTL/ECL Transceivers/Translators)