Datasheet Texas Instruments SN65LVDS31DR — 数据表

制造商Texas Instruments
系列SN65LVDS31
零件号SN65LVDS31DR
Datasheet Texas Instruments SN65LVDS31DR

400 Mbps LVDS四路高速差分驱动器16-SOIC -40至85

数据表

SNx5LVDS31, SN65LVDS3487, SN65LVDS9638: High-Speed Differential Line Drivers datasheet
PDF, 1.9 Mb, 修订版: M, 档案已发布: Jul 29, 2014
从文件中提取

价格

状态

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

打包

Pin16
Package TypeD
Industry STD TermSOIC
JEDEC CodeR-PDSO-G
Package QTY2500
CarrierLARGE T&R
Device MarkingLVDS31
Width (mm)3.91
Length (mm)9.9
Thickness (mm)1.58
Pitch (mm)1.27
Max Height (mm)1.75
Mechanical Data下载

参数化

Device TypeDriver
ESD HBM8 kV
FunctionDriver
ICC(Max)35 mA
Input SignalLVTTL
No. of Tx4
Operating Temperature Range-40 to 85 C
Output SignalLVDS
Package GroupSOIC
Package Size: mm2:W x L16SOIC: 59 mm2: 6 x 9.9(SOIC) PKG
ProtocolsLVDS
Signaling Rate400 Mbps

生态计划

RoHSCompliant

设计套件和评估模块

  • Evaluation Modules & Boards: SN65LVDS31-32BEVM
    SN65LVDS31-32BEVM Evaluation Module for LVDS31 and LVDS32B
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: SN65LVDS31-32EVM
    SN65LVDS31-32EVM Evaluation Module for LVDS31 and LVDS32
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: SN65LVDS31-33EVM
    Evaluation Module for SN65LVDS31 and SN65LVDS33
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • Performance of LVDS with Different Cables (Rev. B)
    PDF, 246 Kb, 修订版: B, 档案已发布: Feb 11, 2002
    This application report focuses on cable for use with LVDS devices rather than printed-circuit board interconnections. After a brief introduction to LVDS, the signal quality of seven different cables is evaluated using eye pattern measurements and TI's LVDS evaluation modules (EVMs). Since data transmission cable covers a wide range of cost and performance, this paper provides guidance for cable s
  • LVDS Multidrop Connections (Rev. A)
    PDF, 809 Kb, 修订版: A, 档案已发布: Feb 11, 2002
    This application report describes design considerations for low-voltage differential swing (LVDS) multidrop connections. The report describes the maximum number of receivers possible versus signaling rate, signal quality, line length, output jitter, and common-mode voltage range when multidrop testing on a single LVDS line driver transmitting to numerous daisy-chained LVDS receivers.The LVDS rec

模型线

制造商分类

  • Semiconductors > Interface > LVDS/M-LVDS/PECL > Buffers, Drivers/Receivers and Cross-Points