Datasheet Texas Instruments SN74ABT16640 — 数据表
制造商 | Texas Instruments |
系列 | SN74ABT16640 |
具有三态输出的16位总线收发器
数据表
16-Bit Bus Transceivers With 3-State Outputs datasheet
PDF, 727 Kb, 修订版: C, 档案已发布: Jan 1, 1997
从文件中提取
价格
状态
SN74ABT16640DGGR | SN74ABT16640DL | SN74ABT16640DLR | |
---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | No |
打包
SN74ABT16640DGGR | SN74ABT16640DL | SN74ABT16640DLR | |
---|---|---|---|
N | 1 | 2 | 3 |
Pin | 48 | 48 | 48 |
Package Type | DGG | DL | DL |
Industry STD Term | TSSOP | SSOP | SSOP |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 2000 | 25 | 1000 |
Carrier | LARGE T&R | TUBE | LARGE T&R |
Device Marking | ABT16640 | ABT16640 | ABT16640 |
Width (mm) | 6.1 | 7.49 | 7.49 |
Length (mm) | 12.5 | 15.88 | 15.88 |
Thickness (mm) | 1.15 | 2.59 | 2.59 |
Pitch (mm) | .5 | .635 | .635 |
Max Height (mm) | 1.2 | 2.79 | 2.79 |
Mechanical Data | 下载 | 下载 | 下载 |
参数化
Parameters / Models | SN74ABT16640DGGR | SN74ABT16640DL | SN74ABT16640DLR |
---|---|---|---|
Bits | 16 | 16 | 16 |
F @ Nom Voltage(Max), Mhz | 150 | 150 | 150 |
ICC @ Nom Voltage(Max), mA | 0.032 | 0.032 | 0.032 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 |
Output Drive (IOL/IOH)(Max), mA | -32/64 | -32/64 | -32/64 |
Package Group | TSSOP | SSOP | SSOP |
Package Size: mm2:W x L, PKG | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 48SSOP: 164 mm2: 10.35 x 15.88(SSOP) | 48SSOP: 164 mm2: 10.35 x 15.88(SSOP) |
Rating | Catalog | Catalog | Catalog |
Schmitt Trigger | No | No | No |
Technology Family | ABT | ABT | ABT |
VCC(Max), V | 5.5 | 5.5 | 5.5 |
VCC(Min), V | 4.5 | 4.5 | 4.5 |
Voltage(Nom), V | 5 | 5 | 5 |
tpd @ Nom Voltage(Max), ns | 4.3 | 4.3 | 4.3 |
生态计划
SN74ABT16640DGGR | SN74ABT16640DL | SN74ABT16640DLR | |
---|---|---|---|
RoHS | Compliant | Compliant | Compliant |
应用须知
- Quad Flatpack No-Lead Logic Packages (Rev. D)PDF, 1.0 Mb, 修订版: D, 档案已发布: Feb 16, 2004
Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while - Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)PDF, 528 Kb, 修订版: B, 档案已发布: Jun 1, 1997
The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide - Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)PDF, 115 Kb, 修订版: A, 档案已发布: Mar 1, 1997
Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions. - Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)PDF, 80 Kb, 修订版: A, 档案已发布: Dec 1, 1996
This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, 档案已发布: May 1, 1996
- Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, 档案已发布: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
模型线
系列: SN74ABT16640 (3)
制造商分类
- Semiconductors> Logic> Buffer/Driver/Transceiver> Standard Transceiver