Datasheet Texas Instruments SN74ACT2229DWR — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN74ACT2229 |
| 零件号 | SN74ACT2229DWR |
256 x 1 x 2双独立同步FIFO存储器28-SOIC -40至85
数据表
Dual 64 X 1, Dual 256 X 1 First-In First-Out Memories datasheet
PDF, 781 Kb, 修订版: C, 档案已发布: Oct 1, 1997
从文件中提取
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 28 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 1000 |
| Carrier | LARGE T&R |
| Device Marking | ACT2229 |
| Width (mm) | 7.5 |
| Length (mm) | 17.9 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | 下载 |
参数化
| Package Group | SOIC |
| Package Size: mm2:W x L | 28SOIC: 184 mm2: 10.3 x 17.9(SOIC) PKG |
| Schmitt Trigger | No |
生态计划
| RoHS | Compliant |
应用须知
- FIFOs With A Word Width Of One Bit (Rev. A)PDF, 133 Kb, 修订版: A, 档案已发布: Mar 1, 1996
In digital systems data is continuously being exchanged between various subsystems. If the data arrives at differing speeds, intermediate storage is necessary. This intermediate storage works on a first-in, first-out (FIFO) basis. This document discusses the basics of FIFOs and gives and overview of their use in telecommunications applications, in modems with data compression, in DSP int - Power-Dissipation Calculations for TI FIFO Products (Rev. A)PDF, 106 Kb, 修订版: A, 档案已发布: Mar 1, 1996
Low power consumption is a major advantage of TI FIFO products. Power calculations are required to meet design requirements for chip temperature and system power. This document assists component and system designers in evaluating power consumption for the ACT and ABT FIFO products. Two examples of power calculations, one for the SN74ACT3632 bi-directional CMOS FIFO and one for the BiCMOS SN74ABT36
模型线
系列: SN74ACT2229 (2)
- SN74ACT2229DW SN74ACT2229DWR
制造商分类
- Semiconductors > Logic > Flip-Flop/Latch/Register > FIFO Register