Datasheet Texas Instruments SN74ALVC164245-EP — 数据表

制造商Texas Instruments
系列SN74ALVC164245-EP
Datasheet Texas Instruments SN74ALVC164245-EP

增强型产品16位2.5V至3.3V / 3.3V至5V电平转换收发器,三态

数据表

SN74ALVC164245-EP datasheet
PDF, 381 Kb, 修订版: A, 档案已发布: Sep 20, 2005
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价格

状态

CALVC164245IDGGREPCALVC164245IDLREPCALVC164245MDGGREPV62/05612-01XEV62/05612-01YEV62/05612-02YE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNo

打包

CALVC164245IDGGREPCALVC164245IDLREPCALVC164245MDGGREPV62/05612-01XEV62/05612-01YEV62/05612-02YE
N123456
Pin484848484848
Package TypeDGGDLDGGDLDGGDGG
Industry STD TermTSSOPSSOPTSSOPSSOPTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY200010002000100020002000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&RLARGE T&R
Device MarkingALVC164245ALVC164245C164245MEPALVC164245ALVC164245C164245MEP
Width (mm)6.17.496.17.496.16.1
Length (mm)12.515.8812.515.8812.512.5
Thickness (mm)1.152.591.152.591.151.15
Pitch (mm).5.635.5.635.5.5
Max Height (mm)1.22.791.22.791.21.2
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参数化

Parameters / ModelsCALVC164245IDGGREP
CALVC164245IDGGREP
CALVC164245IDLREP
CALVC164245IDLREP
CALVC164245MDGGREP
CALVC164245MDGGREP
V62/05612-01XE
V62/05612-01XE
V62/05612-01YE
V62/05612-01YE
V62/05612-02YE
V62/05612-02YE
Bits161616161616
F @ Nom Voltage(Max), Mhz100100100100100100
ICC @ Nom Voltage(Max), mA0.040.040.040.040.040.04
ICCA Static Current, mA0.040.040.040.040.040.04
ICCB Static Current, mA0.040.040.040.040.040.04
Operating Temperature Range, C-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125
Package GroupTSSOPSSOPTSSOPSSOPTSSOPTSSOP
Package Size: mm2:W x L, PKG48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP)
RatingHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced Product
Technology FamilyALVCALVCALVCALVCALVCALVC
VCC(Max), V5.55.55.55.55.55.5
VCC(Min), V2.32.32.32.32.32.3
VCCA(Max), V3.63.63.63.63.63.6
VCCA(Min), V2.32.32.32.32.32.3
VCCB(Max), V5.55.55.55.55.55.5
VCCB(Min), V333333
tpd @ Nom Voltage(Max), ns7.6,5.87.6,5.87.6,5.87.6,5.87.6,5.87.6,5.8

生态计划

CALVC164245IDGGREPCALVC164245IDLREPCALVC164245MDGGREPV62/05612-01XEV62/05612-01YEV62/05612-02YE
RoHSCompliantCompliantCompliantCompliantCompliantCompliant

应用须知

  • TI SN74ALVC16835 Component Specification Analysis for PC100
    PDF, 43 Kb, 档案已发布: Aug 3, 1998
    The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
  • Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
    PDF, 96 Kb, 修订版: A, 档案已发布: May 13, 1998
    Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, 档案已发布: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, 修订版: A, 档案已发布: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

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制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Voltage Level Translation Products