Datasheet Texas Instruments SN74ALVCH16245-EP — 数据表

制造商Texas Instruments
系列SN74ALVCH16245-EP
Datasheet Texas Instruments SN74ALVCH16245-EP

具有三态输出的增强型产品16位总线收发器

数据表

SN74ALVCH16245-EP datasheet
PDF, 286 Kb, 修订版: A, 档案已发布: Mar 8, 2006
从文件中提取

价格

状态

CALVCH16245IDLREPCALVCH16245MDLREPV62/04763-01XEV62/04763-02XE
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNo

打包

CALVCH16245IDLREPCALVCH16245MDLREPV62/04763-01XEV62/04763-02XE
N1234
Pin48484848
Package TypeDLDLDLDL
Industry STD TermSSOPSSOPSSOPSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY1000100010001000
CarrierLARGE T&RLARGE T&RLARGE T&RLARGE T&R
Device MarkingALVCH16245ALCH16245MALVCH16245ALCH16245M
Width (mm)7.497.497.497.49
Length (mm)15.8815.8815.8815.88
Thickness (mm)2.592.592.592.59
Pitch (mm).635.635.635.635
Max Height (mm)2.792.792.792.79
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参数化

Parameters / ModelsCALVCH16245IDLREP
CALVCH16245IDLREP
CALVCH16245MDLREP
CALVCH16245MDLREP
V62/04763-01XE
V62/04763-01XE
V62/04763-02XE
V62/04763-02XE
Bits16161616
Operating Temperature Range, C-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125-40 to 85,-55 to 125
Package GroupSSOPSSOPSSOPSSOP
Package Size: mm2:W x L, PKG48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
RatingHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced ProductHiRel Enhanced Product
Schmitt TriggerNoNoNoNo
Technology FamilyALVCALVCALVCALVC
VCC(Max), V3.63.63.63.6
VCC(Min), V1.651.651.651.65

生态计划

CALVCH16245IDLREPCALVCH16245MDLREPV62/04763-01XEV62/04763-02XE
RoHSCompliantCompliantCompliantCompliant

应用须知

  • Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
    PDF, 154 Kb, 修订版: A, 档案已发布: Sep 8, 1999
    In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
  • TI SN74ALVC16835 Component Specification Analysis for PC100
    PDF, 43 Kb, 档案已发布: Aug 3, 1998
    The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
  • Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
    PDF, 96 Kb, 修订版: A, 档案已发布: May 13, 1998
    Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Understanding Advanced Bus-Interface Products Design Guide
    PDF, 253 Kb, 档案已发布: May 1, 1996
  • Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices
    PDF, 115 Kb, 档案已发布: Dec 1, 1997
    This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn
  • CMOS Power Consumption and CPD Calculation (Rev. B)
    PDF, 89 Kb, 修订版: B, 档案已发布: Jun 1, 1997
    Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale

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制造商分类

  • Semiconductors> Space & High Reliability> Logic Products> Buffers/Drivers/Transceivers> Transceivers