Datasheet Texas Instruments SN74CB3Q16211 — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN74CB3Q16211 |
24位FET 2.5V / 3.3V低压高带宽总线开关
数据表
价格
状态
| SN74CB3Q16211DGGR | SN74CB3Q16211DGVR | SN74CB3Q16211DL | SN74CB3Q16211DLR | SN74CB3Q16211GQLR | SN74CB3Q16211ZQLR | |
|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Obsolete (Manufacturer has discontinued the production of the device) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes | No | Yes | Yes | Yes | No |
打包
| SN74CB3Q16211DGGR | SN74CB3Q16211DGVR | SN74CB3Q16211DL | SN74CB3Q16211DLR | SN74CB3Q16211GQLR | SN74CB3Q16211ZQLR | |
|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 |
| Pin | 56 | 56 | 56 | 56 | 56 | 56 |
| Package Type | DGG | DGV | DL | DL | GQL | ZQL |
| Industry STD Term | TSSOP | TVSOP | SSOP | SSOP | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
| JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PBGA-N | R-PBGA-N |
| Package QTY | 2000 | 2000 | 20 | 1000 | 1000 | |
| Carrier | LARGE T&R | LARGE T&R | TUBE | LARGE T&R | LARGE T&R | |
| Device Marking | CB3Q16211 | BW211 | CB3Q16211 | CB3Q16211 | BW211 | |
| Width (mm) | 6.1 | 4.4 | 7.49 | 7.49 | 4.5 | 4.5 |
| Length (mm) | 14 | 11.3 | 18.41 | 18.41 | 7 | 7 |
| Thickness (mm) | 1.15 | 1.05 | 2.59 | 2.59 | .75 | .75 |
| Pitch (mm) | .5 | .4 | .635 | .635 | .65 | .65 |
| Max Height (mm) | 1.2 | 1.2 | 2.79 | 2.79 | 1 | 1 |
| Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 | 下载 |
参数化
| Parameters / Models | SN74CB3Q16211DGGR | SN74CB3Q16211DGVR | SN74CB3Q16211DL | SN74CB3Q16211DLR | SN74CB3Q16211GQLR | SN74CB3Q16211ZQLR |
|---|---|---|---|---|---|---|
| Additional Features | Powered off protection | Powered off protection | Powered off protection | Powered off protection | IOFF | Powered off protection |
| Approx. Price (US$) | 0.94 | 1ku | |||||
| Bandwidth, MHz | 500 | 500 | 500 | 500 | 500 | |
| Bandwidth(MHz) | 500 | |||||
| Configuration | 1:1 SPST | 1:1 SPST | 1:1 SPST | 1:1 SPST | SPST | 1:1 SPST |
| ESD Charged Device Model, kV | 1 | 1 | 1 | 1 | 1 | |
| ESD Charged Device Model(kV) | 1 | |||||
| ESD HBM, kV | 2 | 2 | 2 | 2 | 2 | |
| ESD HBM(kV) | 2 | |||||
| ICC(Max)(uA) | 3000 | |||||
| Input/Ouput Voltage(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | |
| Input/Ouput Voltage(Max)(V) | 5.5 | |||||
| Input/Output Continuous Current(Max), mA | 64 | 64 | 64 | 64 | 64 | |
| Input/Output Continuous Current(Max)(mA) | 64 | |||||
| Input/Output OFF-state Capacitance(Typ), pF | 4 | 4 | 4 | 4 | 4 | |
| Input/Output ON-state Capacitance(Typ), pF | 10 | 10 | 10 | 10 | 10 | |
| Number of Channels | 24 | 24 | 24 | 24 | 24 | |
| Number of Channels(#) | 24 | |||||
| OFF-state leakage current(Max), µA | 1 | 1 | 1 | 1 | 1 | |
| Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | |
| Operating Temperature Range(C) | -40 to 85 | |||||
| Package Group | TSSOP | TVSOP | SSOP | SSOP | BGA MICROSTAR JUNIOR | BGA MICROSTAR JUNIOR |
| Package Size: mm2:W x L, PKG | 56TSSOP: 113 mm2: 8.1 x 14(TSSOP) | 56TVSOP: 72 mm2: 6.4 x 11.3(TVSOP) | 56SSOP: 191 mm2: 10.35 x 18.42(SSOP) | 56SSOP: 191 mm2: 10.35 x 18.42(SSOP) | 56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR) | |
| Package Size: mm2:W x L (PKG) | 56BGA MICROSTAR JUNIOR: 32 mm2: 4.5 x 7(BGA MICROSTAR JUNIOR) | |||||
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
| Ron(Max), Ohms | 9 | 9 | 9 | 9 | 9 | |
| Ron(Max)(Ohms) | 9 | |||||
| Ron(Typ), Ohms | 5 | 5 | 5 | 5 | 5 | |
| Ron(Typ)(Ohms) | 5 | |||||
| Supply Current(Max), uA | 2000 | 2000 | 2000 | 2000 | 2000 | |
| Supply Current(Typ), uA | 1000 | 1000 | 1000 | 1000 | 1000 | |
| Supply Range, Max | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | |
| VCC(Max)(V) | 3.6 | |||||
| VCC(Min)(V) | 2.3 | |||||
| VIH(Min), V | 1.7 | 1.7 | 1.7 | 1.7 | 1.7 | |
| VIL(Max), V | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 | |
| Vdd(Max), V | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | |
| Vdd(Min), V | 2.3 | 2.3 | 2.3 | 2.3 | 2.3 | |
| Vss(Max), V | N/A | N/A | N/A | N/A | N/A | |
| Vss(Min), V | N/A | N/A | N/A | N/A | N/A |
生态计划
| SN74CB3Q16211DGGR | SN74CB3Q16211DGVR | SN74CB3Q16211DL | SN74CB3Q16211DLR | SN74CB3Q16211GQLR | SN74CB3Q16211ZQLR | |
|---|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Not Compliant | Compliant |
| Pb Free | No |
应用须知
- CBT-C, CB3T, and CB3Q Signal-Switch FamiliesPDF, 584 Kb, 档案已发布: Feb 4, 2003
Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot - Bus FET Switch Solutions for Live Insertion ApplicationsPDF, 300 Kb, 档案已发布: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
模型线
系列: SN74CB3Q16211 (6)
制造商分类
- Semiconductors> Switches and Multiplexers> Analog Switches/Muxes