Datasheet Texas Instruments SN74CBT162292 — 数据表

制造商	Texas Instruments
系列	SN74CBT162292

数据表

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参数化

Parameters / Models	SN74CBT162292DGGR	SN74CBT162292DL
Additional Features	Powered off protection,Internal pull-down resistors,Make-before-break	Powered off protection,Internal pull-down resistors,Make-before-break
Bandwidth, MHz	200	200
Bandwidth(Max), MHz	200	200
Configuration	2:1 SPDT	2:1 SPDT
Input/Ouput Voltage(Max), V	5.5	5.5
Input/Output Continuous Current(Max), mA	128	128
Input/Output OFF-state Capacitance(Typ), pF	8	8
Number of Channels	12	12
OFF-state leakage current(Max), µA	5	5
ON-state leakage current(Max), µA	5	5
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Group	TSSOP	SSOP
Package Size: mm2:W x L, PKG	56TSSOP: 113 mm2: 8.1 x 14(TSSOP)	56SSOP: 191 mm2: 10.35 x 18.42(SSOP)
Rating	Catalog	Catalog
Ron(Max), Ohms	63	63
Ron(Typ), Ohms	37	37
Supply Current(Max), uA	3	3
Supply Range, Max	5.5	5.5
VIH(Min), V	2	2
VIL(Max), V	0.8	0.8
Vdd(Max), V	5.5	5.5
Vdd(Min), V	4	4
Vss(Max), V	N/A	N/A
Vss(Min), V	N/A	N/A

生态计划

应用须知

• 下载
  Flexible Voltage-Level Translation With CBT Family Devices
  PDF, 40 Kb, 档案已发布: Jul 20, 1999
  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
• 下载
  5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
  PDF, 35 Kb, 修订版: B, 档案已发布: Mar 1, 1997
  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
• 下载
  3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
  PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
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  Bus FET Switch Solutions for Live Insertion Applications
  PDF, 300 Kb, 档案已发布: Feb 7, 2003
  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
• 下载
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

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制造商分类

• Semiconductors> Switches and Multiplexers> Analog Switches/Muxes