Datasheet Texas Instruments SN74CBT16244 — 数据表
制造商 | Texas Instruments |
系列 | SN74CBT16244 |
16位FET总线开关
数据表
价格
状态
SN74CBT16244DGGR | SN74CBT16244DGVR | SN74CBT16244DL | SN74CBT16244DLG4 | SN74CBT16244DLR | |
---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | No | No | No | No | No |
打包
SN74CBT16244DGGR | SN74CBT16244DGVR | SN74CBT16244DL | SN74CBT16244DLG4 | SN74CBT16244DLR | |
---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 |
Pin | 48 | 48 | 48 | 48 | 48 |
Package Type | DGG | DGV | DL | DL | DL |
Industry STD Term | TSSOP | TVSOP | SSOP | SSOP | SSOP |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G |
Package QTY | 2000 | 2000 | 25 | 25 | 1000 |
Carrier | LARGE T&R | LARGE T&R | TUBE | TUBE | LARGE T&R |
Device Marking | CBT16244 | CY244 | CBT16244 | CBT16244 | CBT16244 |
Width (mm) | 6.1 | 4.4 | 7.49 | 7.49 | 7.49 |
Length (mm) | 12.5 | 9.7 | 15.88 | 15.88 | 15.88 |
Thickness (mm) | 1.15 | 1.05 | 2.59 | 2.59 | 2.59 |
Pitch (mm) | .5 | .4 | .635 | .635 | .635 |
Max Height (mm) | 1.2 | 1.2 | 2.79 | 2.79 | 2.79 |
Mechanical Data | 下载 | 下载 | 下载 | 下载 | 下载 |
参数化
Parameters / Models | SN74CBT16244DGGR | SN74CBT16244DGVR | SN74CBT16244DL | SN74CBT16244DLG4 | SN74CBT16244DLR |
---|---|---|---|---|---|
Bandwidth, MHz | 200 | 200 | 200 | 200 | 200 |
Configuration | 1:1 SPST | 1:1 SPST | 1:1 SPST | 1:1 SPST | 1:1 SPST |
Input/Ouput Voltage(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
Input/Output Continuous Current(Max), mA | 128 | 128 | 128 | 128 | 128 |
Input/Output OFF-state Capacitance(Typ), pF | 4.5 | 4.5 | 4.5 | 4.5 | 4.5 |
Number of Channels | 16 | 16 | 16 | 16 | 16 |
OFF-state leakage current(Max), µA | 1 | 1 | 1 | 1 | 1 |
ON-state leakage current(Max), µA | 1 | 1 | 1 | 1 | 1 |
Operating Temperature Range, C | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 | -40 to 85 |
Package Group | TSSOP | TVSOP | SSOP | SSOP | SSOP |
Package Size: mm2:W x L, PKG | 48TSSOP: 101 mm2: 8.1 x 12.5(TSSOP) | 48TVSOP: 62 mm2: 6.4 x 9.7(TVSOP) | 48SSOP: 164 mm2: 10.35 x 15.88(SSOP) | 48SSOP: 164 mm2: 10.35 x 15.88(SSOP) | 48SSOP: 164 mm2: 10.35 x 15.88(SSOP) |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog |
Ron(Max), Ohms | 20 | 20 | 20 | 20 | 20 |
Ron(Typ), Ohms | 5 | 5 | 5 | 5 | 5 |
Supply Current(Max), uA | 3 | 3 | 3 | 3 | 3 |
Supply Range, Max | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
VIH(Min), V | 2 | 2 | 2 | 2 | 2 |
VIL(Max), V | 0.8 | 0.8 | 0.8 | 0.8 | 0.8 |
Vdd(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
Vdd(Min), V | 4 | 4 | 4 | 4 | 4 |
Vss(Max), V | N/A | N/A | N/A | N/A | N/A |
Vss(Min), V | N/A | N/A | N/A | N/A | N/A |
生态计划
SN74CBT16244DGGR | SN74CBT16244DGVR | SN74CBT16244DL | SN74CBT16244DLG4 | SN74CBT16244DLR | |
---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
应用须知
- Flexible Voltage-Level Translation With CBT Family DevicesPDF, 40 Kb, 档案已发布: Jul 20, 1999
Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency. - 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)PDF, 35 Kb, 修订版: B, 档案已发布: Mar 1, 1997
The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not - 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
- VOLTAGE LEVEL TRANSLATION (SL) - FamilyPDF, 111 Kb, 档案已发布: Sep 21, 2011
- Bus FET Switch Solutions for Live Insertion ApplicationsPDF, 300 Kb, 档案已发布: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
模型线
系列: SN74CBT16244 (5)
制造商分类
- Semiconductors> Switches and Multiplexers> Analog Switches/Muxes