Datasheet Texas Instruments SN74CBT3126 — 数据表

制造商	Texas Instruments
系列	SN74CBT3126

数据表

价格

状态

打包

参数化

Parameters / Models	SN74CBT3126D	SN74CBT3126DBQR	SN74CBT3126DBQRE4	SN74CBT3126DBQRG4	SN74CBT3126DBR	SN74CBT3126DG4	SN74CBT3126DR	SN74CBT3126DRG4	SN74CBT3126PW	SN74CBT3126PWR	SN74CBT3126PWRG4	SN74CBT3126RGYR
Bandwidth, MHz	200	200	200	200	200	200	200	200	200	200	200	200
Configuration	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST
Input/Ouput Voltage(Max), V	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
Input/Output Continuous Current(Max), mA	128	128	128	128	128	128	128	128	128	128	128	128
Input/Output OFF-state Capacitance(Typ), pF	4	4	4	4	4	4	4	4	4	4	4	4
Number of Channels	4	4	4	4	4	4	4	4	4	4	4	4
OFF-state leakage current(Max), µA	1	1	1	1	1	1	1	1	1	1	1	1
ON-state leakage current(Max), µA	1	1	1	1	1	1	1	1	1	1	1	1
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	SOIC	SSOP	SSOP	SSOP	SSOP	SOIC	SOIC	SOIC	TSSOP	TSSOP	TSSOP	VQFN
Package Size: mm2:W x L, PKG	14SOIC: 52 mm2: 6 x 8.65(SOIC)	16SSOP: 19 mm2: 3.9 x 4.9(SSOP)	16SSOP: 19 mm2: 3.9 x 4.9(SSOP)	16SSOP: 19 mm2: 3.9 x 4.9(SSOP)	16SSOP: 19 mm2: 3.9 x 4.9(SSOP)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14SOIC: 52 mm2: 6 x 8.65(SOIC)	14TSSOP: 32 mm2: 6.4 x 5(TSSOP)	14TSSOP: 32 mm2: 6.4 x 5(TSSOP)	14TSSOP: 32 mm2: 6.4 x 5(TSSOP)	14VQFN: 12 mm2: 3.5 x 3.5(VQFN)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Ron(Max), Ohms	22	22	22	22	22	22	22	22	22	22	22	22
Ron(Typ), Ohms	5	5	5	5	5	5	5	5	5	5	5	5
Supply Current(Max), uA	6	6	6	6	6	6	6	6	6	6	6	6
Supply Range, Max	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
VIH(Min), V	2	2	2	2	2	2	2	2	2	2	2	2
VIL(Max), V	0.8	0.8	0.8	0.8	0.8	0.8	0.8	0.8	0.8	0.8	0.8	0.8
Vdd(Max), V	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5
Vdd(Min), V	4	4	4	4	4	4	4	4	4	4	4	4
Vss(Max), V	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A
Vss(Min), V	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A	N/A

生态计划

应用须知

• 下载
  Optical Implementation Using IEEE-1394.b (Rev. A)
  PDF, 133 Kb, 修订版: A, 档案已发布: Mar 1, 2004
  IEEE Std 1394b-2002 specification allows the use of optical media for longer distances at higher speeds. The use of optical media provides galvanic isolation, lower electromagnetic interference (EMI), and lower interference from the environment.Interfacing 1394.b physical-layer devices (PHYs) may require additional components, depending on the type of fiber-optic transceiver (FOT) selected. Th
• 下载
  Flexible Voltage-Level Translation With CBT Family Devices
  PDF, 40 Kb, 档案已发布: Jul 20, 1999
  Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency.
• 下载
  5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)
  PDF, 35 Kb, 修订版: B, 档案已发布: Mar 1, 1997
  The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not
• 下载
  3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)
  PDF, 32 Kb, 修订版: A, 档案已发布: Apr 3, 1998
• 下载
  VOLTAGE LEVEL TRANSLATION (SL) - Family
  PDF, 111 Kb, 档案已发布: Sep 21, 2011
• 下载
  Bus FET Switch Solutions for Live Insertion Applications
  PDF, 300 Kb, 档案已发布: Feb 7, 2003
  In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ
• 下载
  16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
  PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
  TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

模型线

制造商分类

• Semiconductors> Switches and Multiplexers> Analog Switches/Muxes