Datasheet Texas Instruments SN74GTL2014 — 数据表

制造商Texas Instruments
系列SN74GTL2014
Datasheet Texas Instruments SN74GTL2014

4位LVTTL至GTL收发器

数据表

SN74GTL2014 4-Channel LVTTL to GTL Transceiver datasheet
PDF, 885 Kb, 修订版: A, 档案已发布: Oct 16, 2014
从文件中提取

价格

状态

SN74GTL2014PWR
Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

打包

SN74GTL2014PWR
N1
Pin14
Package TypePW
Industry STD TermTSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Device MarkingGT14
Width (mm)4.4
Length (mm)5
Thickness (mm)1
Pitch (mm).65
Max Height (mm)1.2
Mechanical Data下载

参数化

Parameters / ModelsSN74GTL2014PWR
SN74GTL2014PWR
Bits4
F @ Nom Voltage(Max), Mhz150
ICC @ Nom Voltage(Max), mA10
Operating Temperature Range, C-40 to 85
Output Drive (IOL/IOH)(Max), mA50
Package GroupTSSOP
Package Size: mm2:W x L, PKG14TSSOP: 32 mm2: 6.4 x 5(TSSOP)
RatingCatalog
Schmitt TriggerNo
Technology FamilyGTL
VCC(Max), V3.6
VCC(Min), V3
Voltage(Nom), V3.3
tpd @ Nom Voltage(Max), ns7

生态计划

SN74GTL2014PWR
RoHSCompliant

应用须知

  • GTLP in BTL Applications
    PDF, 248 Kb, 档案已发布: Jul 31, 2000
  • High-Performance Backplane Design With GTL+ (Rev. A)
    PDF, 135 Kb, 修订版: A, 档案已发布: Oct 25, 1999
    Results from a system that demonstrates the performance of GTL+ devices in a backplane are provided. The Texas Instruments (TI) GTL16622A is the example used in the design of the physical backplane. The TI backplane demonstration system is a useful tool for designers in understanding issues related to loading effects, termination, signal integrity, and data-transfer rate in a high-performance
  • Basic Design Considerations for Backplanes (Rev. B)
    PDF, 362 Kb, 修订版: B, 档案已发布: Apr 5, 2001
    This application report describes design issues relevant to the parallel backplanes typically used in the wireless, datacom, telecom, and networking markets. Designing a high-performance backplane is extremely complex, because issues such as distributed capacitance, stub lengths, noise margin, rise time (slew rate), flight time, and propagation delay must be defined and optimized to achieve good s
  • Logic in Live-Insertion Applications With a Focus on GTLP
    PDF, 493 Kb, 档案已发布: Jan 14, 2002
    Live-insertion capability is an essential part of today?s high-speed data systems because those systems are expected to run continuously without being powered down. This application report delves into the cause and prevention of live-insertion and nanosecond-discontinuity effects, using both simulation and actual test measurements from a specially built GTLP EVM. Hypothetical cases for precharge c
  • Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)
    PDF, 585 Kb, 档案已发布: Apr 5, 2001
    This application report compares two approaches for synchronous bus-system designs. The focus of the report is the comparison of a system using central-synchronous system clock (CSSC) with a system operated with a source-synchronous system clock (SSSC).The basic characteristics of lines, key factors that influence the bus line delay, and the impedance of bus lines are described.The theoretical
  • Fast GTLP Backplanes With the GTLPH1655 (Rev. A)
    PDF, 1.1 Mb, 修订版: A, 档案已发布: Sep 19, 2000
    This revision of the Fast GTL Backplanes With the GTL1655 application report addresses improvements, such as the improved OECE circuitry and implementation of theTexas Instruments TI-OPCE circuitry, that have been incorporated in the GTLPH1655 device. These improvements significantly improve signal integrity in distributed loads.This application report describes the physical principles of fast
  • GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
    PDF, 184 Kb, 修订版: A, 档案已发布: Mar 1, 1997
    GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, 修订版: B, 档案已发布: Apr 30, 2015
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, 档案已发布: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

模型线

系列: SN74GTL2014 (1)

制造商分类

  • Semiconductors> Logic> Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)