Datasheet Texas Instruments CLVC1G175MDCKREPG4 — 数据表
制造商 | Texas Instruments |
系列 | SN74LVC1G175-EP |
零件号 | CLVC1G175MDCKREPG4 |
具有异步清零功能的增强型产品单D型触发器6-SC70 -55至125
数据表
价格
状态
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
打包
Pin | 6 |
Package Type | DCK |
Industry STD Term | SOT-SC70 |
JEDEC Code | R-PDSO-G |
Package QTY | 3000 |
Carrier | LARGE T&R |
Device Marking | BUD |
Width (mm) | 1.25 |
Length (mm) | 2 |
Thickness (mm) | .9 |
Pitch (mm) | .65 |
Max Height (mm) | 1.1 |
Mechanical Data | 下载 |
参数化
3-State Output | No |
Bits | 1 |
F @ Nom Voltage(Max) | 150 Mhz |
Gate Type | FLIP-FLOP |
ICC @ Nom Voltage(Max) | 0.01 mA |
Input Type | CMOS/TTL |
Logic | True |
Operating Temperature Range | -55 to 125 C |
Output Drive (IOL/IOH)(Max) | 32/-32 mA |
Output Type | CMOS |
Package Group | SC70 |
Package Size: mm2:W x L | 6SC70: 4 mm2: 2.1 x 2(SC70) PKG |
Rating | HiRel Enhanced Product |
Schmitt Trigger | No |
Sub-Family | D-Type Flip-Flop |
Technology Family | LVC |
VCC(Max) | 5.5 V |
VCC(Min) | 1.65 V |
Voltage(Nom) | 1.8,2.5,3.3,5 V |
tpd @ Nom Voltage(Max) | 16,9,8,5 ns |
生态计划
RoHS | Compliant |
应用须知
- 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, 修订版: B, 档案已发布: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Use of the CMOS Unbuffered Inverter in Oscillator CircuitsPDF, 796 Kb, 档案已发布: Nov 6, 2003
CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly - LVC Characterization InformationPDF, 114 Kb, 档案已发布: Dec 1, 1996
This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices. - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, 修订版: A, 档案已发布: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, 档案已发布: May 1, 1996
- Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, 档案已发布: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features - How to Select Little Logic (Rev. A)PDF, 1.1 Mb, 修订版: A, 档案已发布: Jul 26, 2016
TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b - Migration From 3.3-V To 2.5-V Power Supplies For Logic DevicesPDF, 115 Kb, 档案已发布: Dec 1, 1997
This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn - Texas Instruments Little Logic Application ReportPDF, 359 Kb, 档案已发布: Nov 1, 2002
Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond - Power-Up Behavior of Clocked Devices (Rev. A)PDF, 34 Kb, 修订版: A, 档案已发布: Feb 6, 2015
模型线
系列: SN74LVC1G175-EP (3)
- CLVC1G175MDCKREP CLVC1G175MDCKREPG4 V62/06633-01XE
制造商分类
- Semiconductors > Space & High Reliability > Logic Products > Little Logic Products