Datasheet Texas Instruments SN74V293-7PZA — 数据表
| 制造商 | Texas Instruments |
| 系列 | SN74V293 |
| 零件号 | SN74V293-7PZA |
65536 x 18同步FIFO存储器80-LQFP 0至70
数据表
价格
状态
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
打包
| Pin | 80 |
| Package Type | PZA |
| Industry STD Term | LQFP |
| JEDEC Code | S-PQFP-G |
| Package QTY | 90 |
| Carrier | JEDEC TRAY (5+1) |
| Device Marking | V293-7 |
| Width (mm) | 14 |
| Length (mm) | 14 |
| Thickness (mm) | 1.4 |
| Pitch (mm) | .65 |
| Max Height (mm) | 1.6 |
| Mechanical Data | 下载 |
参数化
| Package Group | LQFP |
| Package Size: mm2:W x L | 80LQFP: 256 mm2: 16 x 16(LQFP) PKG |
| Schmitt Trigger | No |
生态计划
| RoHS | Compliant |
应用须知
- Design Considerations of SN74V293 FIFO in a MicroStar BGA(TM) Package (Rev. A)PDF, 112 Kb, 修订版: A, 档案已发布: Apr 10, 2002
Texas Instruments? near-chip-scale MicroSTAR BGA? package is gaining in popularity for applications where board space and/or weight are significant design factors. However, no less-significant design factors are those associated with electronic coupling between signal paths when leading-edge high-speed digital signals are closely spaced.With a few simple routing and trace-location consideratio - Power-Dissipation Calculations for TI FIFO Products (Rev. A)PDF, 106 Kb, 修订版: A, 档案已发布: Mar 1, 1996
Low power consumption is a major advantage of TI FIFO products. Power calculations are required to meet design requirements for chip temperature and system power. This document assists component and system designers in evaluating power consumption for the ACT and ABT FIFO products. Two examples of power calculations, one for the SN74ACT3632 bi-directional CMOS FIFO and one for the BiCMOS SN74ABT36
模型线
系列: SN74V293 (5)
- SN74V293-10PZA SN74V293-15PZA SN74V293-15PZAG4 SN74V293-6PZA SN74V293-7PZA
制造商分类
- Semiconductors > Logic > Flip-Flop/Latch/Register > FIFO Register
其他名称:
SN74V2937PZA, SN74V293 7PZA