Datasheet Texas Instruments SN74V293 — 数据表

制造商	Texas Instruments
系列	SN74V293

65536 x 18同步FIFO存储器

数据表

PDF, 818 Kb, 修订版: D, 档案已发布: Feb 12, 2003

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	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	No	No	No	No	No

	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
N	1	2	3	4	5
Pin	80	80	80	80	80
Package Type	PZA	PZA	PZA	PZA	PZA
Industry STD Term	LQFP	LQFP	LQFP	LQFP	LQFP
JEDEC Code	S-PQFP-G	S-PQFP-G	S-PQFP-G	S-PQFP-G	S-PQFP-G
Package QTY	90	90	90	90	90
Carrier	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)	JEDEC TRAY (5+1)
Device Marking	V293-10	V293-15	V293-15	V293-6	V293-7
Width (mm)	14	14	14	14	14
Length (mm)	14	14	14	14	14
Thickness (mm)	1.4	1.4	1.4	1.4	1.4
Pitch (mm)	.65	.65	.65	.65	.65
Max Height (mm)	1.6	1.6	1.6	1.6	1.6
Mechanical Data	下载	下载	下载	下载	下载

Parameters / Models	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
Package Group	LQFP	LQFP	LQFP	LQFP	LQFP
Package Size: mm2:W x L, PKG	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)	80LQFP: 256 mm2: 16 x 16(LQFP)
Schmitt Trigger	No	No	No	No	No

	SN74V293-10PZA	SN74V293-15PZA	SN74V293-15PZAG4	SN74V293-6PZA	SN74V293-7PZA
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant

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Design Considerations of SN74V293 FIFO in a MicroStar BGA(TM) Package (Rev. A)
PDF, 112 Kb, 修订版: A, 档案已发布: Apr 10, 2002
Texas Instruments? near-chip-scale MicroSTAR BGA? package is gaining in popularity for applications where board space and/or weight are significant design factors. However, no less-significant design factors are those associated with electronic coupling between signal paths when leading-edge high-speed digital signals are closely spaced.With a few simple routing and trace-location consideratio
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Power-Dissipation Calculations for TI FIFO Products (Rev. A)
PDF, 106 Kb, 修订版: A, 档案已发布: Mar 1, 1996
Low power consumption is a major advantage of TI FIFO products. Power calculations are required to meet design requirements for chip temperature and system power. This document assists component and system designers in evaluating power consumption for the ACT and ABT FIFO products. Two examples of power calculations, one for the SN74ACT3632 bi-directional CMOS FIFO and one for the BiCMOS SN74ABT36

系列: SN74V293 (5)