Datasheet Texas Instruments TCI6630K2LCMSA — 数据表

制造商Texas Instruments
系列TCI6630K2L
零件号TCI6630K2LCMSA
Datasheet Texas Instruments TCI6630K2LCMSA

多核DSP + ARM KeyStone II片上系统(SoC)900-FCBGA

数据表

TCI6630K2L Multicore DSP+ARM KeyStone II System-on-Chip (SoC) datasheet
PDF, 1.9 Mb, 修订版: E, 档案已发布: Jan 27, 2015
从文件中提取

价格

状态

Lifecycle StatusPreview (Device has been announced but is not in production. Samples may or may not be available)
Manufacture's Sample AvailabilityNo

打包

Pin900
Package TypeCMS
Package QTY44
Width (mm)25
Length (mm)25
Thickness (mm)2.98
Mechanical Data下载

参数化

ARM CPU2 Cortex-A15
DSP4 C66x
RatingCatalog

生态计划

RoHSNot Compliant

设计套件和评估模块

  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: XTCIEVMK2LX
    TCI6630K2L Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

应用须知

  • KeyStone I-to-KeyStone II Migration Guide (Rev. A)
    PDF, 479 Kb, 修订版: A, 档案已发布: Jul 30, 2015
    This guide describes the main System-on-Chip (SoC) level and peripheral changes that need to be considered when migrating a KeyStone I-based system design to a KeyStone II-based system design.In this guide, KeyStone I includes all TMS320TCI661x devices and KeyStone II includes all TCI663xK2y devices. Any differences within KeyStone I or KeyStone II devices are described explicitly.
  • TPS544Bxx/TPS544Cxx Powering TCI6630K2L in Smart Reflex Class 0 TC Mode
    PDF, 154 Kb, 档案已发布: Sep 18, 2015
    This application report describes an application circuit example of the TPS544B/Cxx family of power management IC (PMIC) powering the Smart-Reflex digital core supply of the TCI6630K2L SoC. Smart-Reflex Class 0 Temperature Compensation (Class 0 TC) mode of operation of the TCI6630K2L device is emphasized. Assumption is that temperature compensation mode is enabled using the function provided in th
  • Keystone II DDR3 Initialization
    PDF, 73 Kb, 档案已发布: Jan 26, 2015
    This application report provides a step-to-step initialization guide for the Keystone II device DDR3 SDRAM controller.
  • Throughput Performance Guide for KeyStone II Devices (Rev. B)
    PDF, 866 Kb, 修订版: B, 档案已发布: Dec 22, 2015
    This application report analyzes various performance measurements of the KeyStone II family of processors. It provides a throughput analysis of the various support peripherals to different end-points and memory access.
  • Keystone II DDR3 Debug Guide
    PDF, 143 Kb, 档案已发布: Oct 16, 2015
    This guide provides tools for use when debugging a failing DDR3 interface on a KeyStone II device.
  • Power Management of KS2 Device (Rev. C)
    PDF, 61 Kb, 修订版: C, 档案已发布: Jul 15, 2016
    This application report lists the steps to enable Class 0 Temperature Compensation (Class 0 TC) mode of SmartReflexв„ў Subsystem (SRSS) module available on such devices.
  • Hardware Design Guide for KeyStone II Devices
    PDF, 1.8 Mb, 档案已发布: Mar 24, 2014
  • SERDES Link Commissioning on KeyStone I and II Devices
    PDF, 138 Kb, 档案已发布: Apr 13, 2016
    The serializer-deserializer (SerDes) performs serial-to-parallel conversions on data received from a peripheral device and parallel-to-serial conversion on data received from the CPU. This application report explains the SerDes transmit and receive parameters tuning, tools and some debug techniques for TI Keystone I and Keystone II devices.
  • PCIe Use Cases for KeyStone Devices
    PDF, 320 Kb, 档案已发布: Dec 13, 2011
  • The C6000 Embedded Application Binary Interface Migration Guide (Rev. A)
    PDF, 20 Kb, 修订版: A, 档案已发布: Nov 10, 2010
    The C6000 compiler tools support a new ELF-based ABI named EABI. Prior to this time, the compiler only supported a single ABI, which is now named COFF ABI. The following compelling best-in-class features are available under the C6000 EABI:GeneralZero-init globals: “int gvar;” gets set to 0 before main runs.Dynamic linking: Add code to a running system.Native ROM
  • Clocking Design Guide for KeyStone Devices
    PDF, 1.5 Mb, 档案已发布: Nov 9, 2010
  • Optimizing Loops on the C66x DSP
    PDF, 585 Kb, 档案已发布: Nov 9, 2010
  • DDR3 Design Requirements for KeyStone Devices (Rev. B)
    PDF, 582 Kb, 修订版: B, 档案已发布: Jun 5, 2014
  • Multicore Programming Guide (Rev. B)
    PDF, 1.8 Mb, 修订版: B, 档案已发布: Aug 29, 2012
    As application complexity continues to grow, we have reached a limit on increasing performance by merely scaling clock speed. To meet the ever-increasing processing demand, modern System-On-Chip solutions contain multiple processing cores. The dilemma is how to map applications to multicore devices. In this paper, we present a programming methodology for converting applications to run on multicore

模型线

系列: TCI6630K2L (1)
  • TCI6630K2LCMSA

制造商分类

  • Semiconductors > Processors > Communications Processors > TCI66x